Abstract
Each new generation of IC devices brings about a corresponding decrease in
linewidths and minimum feature sizes. The technological trends and innovations
in IC fabrication processes directly influence the market for masks and mask
making equipment. This market is one the most competitive of all front-end
semiconductor equipment markets, due to the high price of the equipment and
the potential for high profit.
The growth of the mask market is less than the semiconductor market, even
though there is a trend to more layers per design due to increased device
complexity, because of the numerous devices that can be made from one mask
set. The growth of the ASIC market has a strong upward influence on the number
of layers and the merchant average selling price, in which merchant average
sale prices are the value basis of the captive market. Nevertheless, ASIC
manufacturers are maximizing the utilization of masks in an effort to minimize
costs, just as the elimination of contact aligners in the fab has extended the
lifetime of mask sets. The combination of pellicles, 12-to-16-hour mask
turnaround times, and sophisticated CAD programs and design rule checks
further reduce the need for more than one mask set per design.
Both revenues and costs have been affected by the increased demand for
high-end technology photomasks that require more advanced manufacturing
capabilities but generally command higher average selling prices. To meet the
technological demands of its customers and position for future growth, vendors
must continue to make substantial investments in high-end manufacturing
capability both at existing and new facilities.
Photomask demand is driven principally by new design activity, which is
gaining momentum in all regions. Additionally, growth is being fueled by
customers' ramp of new advanced steppers and scanners that utilize the most
advanced photomask products, resulting in higher average selling prices and
margins.
Demand for increasingly complex photomask technologies is showing broad based
stability as semiconductor designers steadily release 90 nanometer and 65
nanometer products.
This report addresses the strategic issues impacting the mask making,
inspection, and repair sectors of the semiconductor industry. The mask making
markets are analyzed and projected.
This report examines and projects the technologies involved, their likely
developments, why and when their introduction or demise will take place, what
problems and choices are facing users, and where the opportunities and
pitfalls are.
View Cart
