Cluster Tools In IC Processing: Technology and Market Forecasts

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

• 2.1 Summary of Technical Issues
• 2.2 Summary of Market Forecast

Chapter 3 Interface Standards

• 3.1 SEMI/MESC
  • SECS I and SECS II
• 3.3 High-Speed Secs Message Services (HSMS) Standard
• 3.4 GEM
• 3.5 Standards Directions

Chapter 4 The Cluster Concept

• 4.1 Definitions
• 4.2 Device Technology and Integrated Processing
• 4.3 Main Functional Units
  • 4.3.1 Central Handling Platform
  • 4.3.2 Cassette Stations
  • 4.3.3 Extension Modules
  • 4.3.4 Single Process Modules
  • 4.3.5 Batch Modules
  • 4.3.6 Multiple Process Modules
• 4.4 Cluster Tool Communications
  • 4.4.1 Cluster Tool Controller
  • 4.4.2 Transport Module Controller
  • 4.4.3 Process Module Controller
  • 4.4.4 Control Software
  • 4.4.5 Human Interface Software
  • 4.4.6 Networking Software
• 4.5 Vacuum System Design

Chapter 5 Commercial Cluster Tools

• 5.1 Cluster Tools and Suppliers
  • AIO
  • Alcatel
  • Anelva
  • Apex
  • Applied Materials
  • ASM
  • ASML
  • Aviza Technology
  • BLE Laboratory Equipment
  • Brooks Automation
  • Convac-APT
  • Couger Labs
  • DaiNippon Screen
  • Ebara
  • FSI International
  • Genmark
  • Genus
  • Ginitech
  • Hitachi
  • IPS
  • Jipelec
  • Jusung Engineering
  • Kanematsu Semiconductor
  • Kokusai
  • Kornic
  • Lam Research
  • Mattson Technology
  • Modern Industries
  • Modular Process Technology
  • Novellus Systems
  • Oxford Instruments Plasma Technology
  • Primaxx
  • Rorze
  • Samsung Electronics
  • SC Fluids
  • Semitool
  • Sentech
  • Surface Technology Systems
  • Suss MicroTec AG
  • Tegal
  • Tek-Vac
  • Thermo Electron Corp.
  • Tokyo Electron
  • Trikon Technologies
  • Ulvac
  • Unaxis
  • Vactronics Lab Equipment
  • Veeco
• 5.2 Process Modules and Suppliers
  • AXIC
  • Nanaometrics
  • Nicolet
  • Nova Measuring Instruments
  • Pfeiffer Vacuum
  • XMR

Chapter 6 Cluster Tool Process Trends

• 6.1 Introduction
• 6.2 Deposition - Plasma Etch
• 6.3 Deposition - Rapid Thermal Processing
• 6.4 Lithography - Resist Processing
• 6.5 Diagnostics - Process
• 6.6 CMP Polish - Clean

Chapter 7 Cluster Tool Issues

• 7.1 Introduction
• 7.2 Equipment Reliability
• 7.3 Equipment Maintainability
• 7.4 Challenges
• 7.5 Opportunities

Chapter 8 Economic and Human Resource Issues

• 8.1 Introduction
• 8.2 Economic Justification
  • 8.2.1 Background
  • 8.2.2 Cost Justification
  • 8.2.3 Reserves
  • 8.2.4 Personnel Costs
  • 8.2.5 Other ROI Considerations
• 8.3 Human Resources Impact
  • 8.3.1 Background
  • 8.3.2 Direct Labor
  • 8.3.3 Equipment Support
  • 8.3.4 Process Engineering
  • 8.3.5 Operations Staff

Chapter 9 Market Forecast

• 9.1 Introduction
• 9.2 Market Forecast Assumptions
• 9.3 Market Forecast
  • 9.3.1 Total Available Equipment Market
  • 9.3.2 Flexible Cluster Tool Market
  • 9.3.3 Non-Flexible Cluster Tool Market
  • 9.3.4 Total Cluster Tool Market

FIGURES

• 3.1 Trend in Use of SECS by Equipment Manufacturers
• 4.1 Basic Cluster Tool Architecture
• 4.2 Basic Cluster Tool Architecture
• 4.3 Communication Architecture in a Cluster Tool
• 5.1 Anelva's Cu CVD Process Tool
• 5.2 Process Chambers in Applied Materials'
• EPI Centura System
• 5.3 Brooks Automation's Gemini Express 8000
• 5.4 Process Chambers in Hitachi's M600 Etcher
• 8.1 Segmentation of Operator Processing Functions
• 9.1 Shares of the Total Available Market
• 9.2 Market Forecast of Flexible Cluster Tools
• 9.3 Market Shares of Flexible Cluster Tools
• 9.4 Market Forecast of Non-Flexible Cluster Tools
• 9.5 Market Shares of Non-Flexible Cluster Tools
• 9.6 Cluster Tools vs Total Available Market
• 9.7 Cluster Tools vs Total Available Market
• 9.8 Cluster Tools as % of TAM

TABLES

• 3.1 Corporate Participants in SEMI/MESC
• 4.1 Model for DRAM Production Line
• 9.1 Total Available Equipment Market Forecast
• 9.2 Total Cluster Tool Equipment Market Forecast