Abstract
Driven by the needs in the semiconductor industry for planar wafers across the
die and across the wafer, chemical mechanical polishing (CMP) has emerged as
the technology of choice among semiconductor manufacturers. While other
planarization methods are satisfactory on the 0.35 μm and above regime of
feature sizes, only CMP offers exemplary capabilities below 0.35 μm.
The advantages of CMP are:
- Improved global planarity over non-CMP methods
- Compatible with any conventional dielectric
- Global planarity at 0.35 μm or less feature sizes
- Reduced process steps, particularly lithography
- Can define horizontal and vertical wiring
- Alternative to some defect-prone processes such as etch-back
- Reduced defect density
- Can provide alternative architectures such as damascene
CMP, a key enabling process technology first developed in the mid-1980s, is
necessary to produce nearly flat surfaces for lithography as well as many of
the structures used in current and future devices. Because of depth-of-field
limitations with lithography tools, portions of exposed areas would be out of
focus at the highest or lowest point. CMP is used to produce shallow trench
isolations (for tighter device to device spacing), capacitors, and to
planarize insulators that conformally coat conductors.
This technology-marketing report examines and projects the technologies
involved in the planarization of semiconductor layers. The Emphasis is on
Chemical Mechanical Polishing (CMP), a process technology that has emerged as
a key solution to many of the problems associated with uneven surface
topography on IC devices. Current issues related to this technology are
addressed.
The complete CMP process is a combination of numerous types of equipment and
consumables. Demand in the semiconductor industry is not limited to polishers
and oxide slurries, but from a plethora of new pad and slurry combinations
arising from the need to planarize such metals as aluminum, tungsten, and
copper.
Other technologies will see a concomitant growth with the polisher and
consumables market. These include efficient distribution systems to mix,
dilute, filter, and deliver slurry and post-CMP clean materials to the CMP
modules and post-CMP clean systems; and metrology equipment to measure
planarity, film thickness, and surface defects.
This report discusses the technology trends, products, applications, and
suppliers of materials and equipment. It also gives insights to suppliers for
future user needs and should assist them in long-range planning, new product
development and product improvement. A market forecast for CMP equipment and
materials is presented.
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