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[Report]

Semiconductor Factory Automation: Technology Issues and Market Forecasts

Published: 2008/03

Contact 24 hrs/day
Description

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

  • 2.1 Summary of Major Issues
  • 2.2 Summary of Market Forecasts

Chapter 3 Driving Forces

  • 3.1 Introduction
  • 3.2 Trend to 300 mm Wafers
  • 3.3 Development Costs
  • 3.4 Single-Wafer Processing
  • 3.5 Trends in Processing Tools
  • 3.6 Automation Trends
  • 3.7 Benefits of Automated Wafer Handling

Chapter 4 Software

  • 4.1 Introduction
  • 4.2 The Evolution of CIM
  • 4.3 MES in Industry
    • 4.3.1 MES Functionalities
    • 4.3.2 MES Products
  • 4.4 Communication Standards
  • 4.5 Sematech CIM Framework

Chapter 5 Hardware

  • 5.1 Introduction
  • 5.2 Elements of Automation
    • 5.2.1 Tool Automation
    • 5.2.2 Intrabay Automation
    • 5.2.3 Interbay Automation
    • 5.2.4 Material-Control System
  • 5.3 Flexible Automation
  • 5.4 Reliability
  • 5.5 Tool Issues and Trends
    • 5.5.1 Flexible Tool Interface
    • 5.5.2 Vacuum Robotics
    • 5.5.3 AGV
    • 5.5.4 CMP
    • 5.5.5 300-mm Wafer Transport
    • 5.5.6 Mini-Environments and Cleanroom Issues
  • 5.6 E-Manufacturing

Chapter 6 Market Analysis

  • 6.1 Market Forces
  • 6.2 Market Forecast Assumptions
  • 6.3 Market Forecast
    • 6.3.1 Automated Transfer Tool Market
    • 6.3.2 Carrier Transport Market
    • 6.3.3 MES Software Market

Chapter 7 Issues 7-1

  • 7.1 Current Automation Thinking
  • 7.2 The New Factory Paradigm
  • 7.3 The New Factory in Action
  • 7.4 Return on Investment Considerations
  • 7.5 Eight Symptoms of the Old Paradigm
  • 7.6 Putting the New Paradigm to Work

LIST OF FIGURES

  • 1.1 Advanced CIM System
  • 3.1 Automated Materials Handling System (AMHS) Framework
  • 4.1 Evolution of CIM
  • 4.2 Computer Integrated Fab Environment
  • 4.3 Message Integration in CIM
  • 4.4 Sematech CIM Framework Scope
  • 5.1 Material-Control System
  • 5.2 Traditional and Flexible Automated Material Handling System
  • 5.3 Overhead Monorail Delivery - Cassette in Box, Cassette in SMIF Pod
  • 5.4 Stocker Design and Interfaces
  • 5.5 Layout Of a 45nm 300mm Fab
  • 5.6 Interfaces To Factory Automation Systems
  • 6.1 Semiconductor Equipment Utilization
  • 6.2 Revenue Losses from Wafer Defects
  • 6.3 Market Shares of Automated Wafer Transfer Suppliers
  • 6.4 Worldwide Market Shares of Carrier Transport Suppliers
  • 6.5 Worldwide Market of Shares MES Software Suppliers
  • 6.6 Worldwide Market Shares Of Fab System Integration Software

LIST OF TABLES

  • 5.1 Evolution Of Factory Metrics
  • 6.1 Three-Year Savings for Automation
  • 6.2 Cost of Alternative Automated Systems
  • 6.3 Three-year Costs for Alternative Automated Systems Worldwide Forecast of Automated Transfer Tools
  • 6.5 Process Tool Automation For 300mm Fabs
  • 6.6 Worldwide Forecast of Carrier Transport Market
  • 6.7 Worldwide Fab Installation Forecast
  • 6.8 Worldwide Forecast of MES Software
Description

[Report]
Semiconductor Factory Automation: Technology Issues and Market Forecasts
Published: 2008/03
Published by : The Information Network The Information Network

Price:
US $ 2,495.00 PDF by E-mail
US $ 2,545.00 PDF by E-mail & Hard Copy
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Product Code : IF4968
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