Abstract
High-density packaging offer a host of benefits including performance
improvements such as shorter interconnect lengths between die, resulting in
reduced time of flight, lower power supply inductance, lower capacitance
loading, less cross talk and lower off-chip driver power. High-density
packages result in a smaller overall package when compared to packaged
components performing the same function, hence resulting I/O to the system
board is significantly reduced. By sweeping several devices onto one package,
board complexity is simplified, thereby by reducing total opportunities for
error at the board assembly level.
High-density packages have been subcategorized to better define their content
and function.
An MCM is described as a package combining multiple IC's into a single
system-level unit. The resulting module is capable of handling an entire
function. These MCM packages typically have custom pin out configurations as
well.
MCP, or multi-chip packages (sometimes referred to as few chip packages), are
typically low lead count combinations of simple IC's. For these packages
system control still occurs at the board level. They are primarily produced in
volume in standard pin out and package configurations such as DIPs SOJs, QFPs
and BGAs.
System-in-Package (SIP) is much more than an IC package containing multiple
die. SIP products are fully functional systems or sub-systems in an IC package
format. SIP may contain one or more IC chips (wirebonded or flip chip) plus
other components that are traditionally found on the system mother board.
The increasing complexity and integration of electronic systems require
advanced packaging and multichip module (MCM) techniques.
Various types of multichip packages (MCPs) have been used for many years, but
costs have always kept volumes relatively low. Now, however, the felicitous
combination of SRAM and flash memory chips in a single package for cell-phone
applications is finally creating a high-growth, high-volume market for the
multichip packaging.
Multichip packages hold high growth potential, but confusion with MCM
technology makes exact forecasting difficult. Regardless of nomenclature, the
forecasts offer proof that, by offering high performance in miniaturized
spaces, MCPs make an attractive solution for next-generation wireless
applications, primarily in mobile phones, but are also likely to become
commonplace in various notebook computing applications.
SIP is basically an MCM, but it provides higher density and better
time-to-market than the older MCM technology. While MCMs excel in reusability
and flexibility, and SoCs excel at performance and density, the SIP is a
compromise between the two. Testability and yield are the key deciding factors
in the choice between SoC and SIP.
SIP technology is an ideal solution in markets that demand smaller size with
increased functionality. However, SIP has the added benefit of compatibility
with die design changes and integration of various die technologies (e.g., Si,
GaAs, SiGe, SOI, MEMS and Optical) without the high cost and lead time
associated with SoC development and manufacturing.
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