Abstract
CHAPTER 1
INTRODUCTION
Thin film deposition processes play a critical role in the production of
high-density, high-performance microelectronic products.
Considerable progress has been achieved in the development of deposition
processes -- and in the development of the reactor systems in which they are
carried out. This report discusses relevant mechanisms; processing,
system, and materials aspects, potential advances, and considerations
regarding extendibility to a wafer diameter of 300 mm.
With the introduction of new thin-film materials to consistently
shrinking microelectronic devices and circuits, and as the aperture ratio of
an integrated-circuit structure increases, conformal step coverage
becomes increasingly difficult to achieve. This report compares some
of the issues impacting users of different deposition tools, including:
APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD.
In addition., as device geometries shrink, semiconductor manufacturing has
become increasingly complex and precise, requiring a
better understanding of the specific processes involved. These issues are
described in the report.
This report discusses the technology trends, products, applications, and
suppliers of materials and equipment. It also gives insights to
suppliers for future user needs and should assist them in long range
planning, new product development and product improvement. A market
forecast for Thin Film Deposition Tools is presented to 2004.
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