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[Report]

Thin Film Deposition: Trends, Key Issues, Market Analysis

Published: 2007/12

Contact 24 hrs/day
Description

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Physical Vapor Deposition

  • 3.1 Introduction
  • 3.2 Sputtering Technology
  • 3.3 Plasma Technology
  • 3.4 Reactor Designs
    • 3.4.1 Long-Throw Deposition
    • 3.4.2 Collimated Sputter Deposition
    • 3.4.3 Showerhead Deposition
    • 3.4.4 Ionized PVD
  • 3.5 Semiconductor Processing
    • 3.5.1 Feature Patterning
    • 3.5.2 Gap Fill
  • 3.6 Targets

Chapter 4 Chemical Vapor Deposition

  • 4.1 Introduction
  • 4.2 Chemical Vapor Deposition (CVD) Techniques
    • 4.2.1 APCVD
    • 4.2.2 LPCVD
    • 4.2.3 PECVD
    • 4.2.4 HDPCVD
    • 4.2.5 ALD

Chapter 5 Electrochemical Deposition

  • 5.1 Introduction
  • 5.2 Reactor Design
  • 5.3 Challenges
  • 5.4 Additives
  • 5.5 Processing
    • 5.5.1 Superfilling
    • 5.5.2 Aspect Ratios
  • 5.6 Copper Cathodes
  • 5.7 Wet Copper Seed-Layer

Chapter 6 Film Deposition And Film Properties

  • 6.1 Introduction
  • 6.2 Dielectric Deposition
    • 6.2.1 Silicon Dioxide
      • 6.2.1.1 Thermal CVD
      • 6.2.1.2 PECVD
      • 6.2.1.3 HDPCVD
    • 6.2.2 Silicon Nitride
      • 6.2.2.1 Thermal CVD
      • 6.2.2.2 PECVD
      • 6.2.2.3 HDPCVD
    • 6.2.3 High-K Dielectrics
    • 6.2.4 Low-K Dielectrics
  • 6.3 Metal Deposition
    • 6.3.1 Aluminum
    • 6.3.2 Tungsten/Tungsten Silicide
    • 6.3.3 Titanium Nitride

Chapter 7 Vendor Issues

  • 7.1 Introduction
  • 7.2 300mm Processing
  • 7.3 Integrated Processing
  • 7.4 Copper
  • 7.5 Metrology
  • 7.6 ESD
  • 7.7 Parametric Test

Chapter 8 Market Forecast

  • 8.1 Introduction
  • 8.2 Key Issues
  • 8.3 Market Forecast Assumptions
  • 8.4 Market Forecast
    • 8.4.1 Chemical Vapor Deposition
    • 8.4.2 Physical Vapor Deposition
    • 8.4.3 Copper Electroplating Market
    • 8.4.4 Atomic Layer Deposition Market

FIGURES

  • 3.1 Schematic Of Sputtering System
  • 3.2 Magnetron Sputtering Design
  • 3.3 Showerhead Reactor Design
  • 3.4 Ionized PVD
  • 4.1 APCVD Reactor
  • 4.2 Tube CVD Reactor
  • 4.3 HDPCVD Reactor
  • 4.4 ALD Versus PVD Copper Barrier
  • 5.1 Copper Electroplating System
  • 8.1 Worldwide MCVD Market Shares
  • 8.2 Worldwide DCVD Market Shares
  • 8.3 Worldwide DCVD Market By Sectors
  • 8.4 Worldwide HDHCVD Market Shares
  • 8.5 Worldwide PECVD Market Shares
  • 8.6 Worldwide SACVD Market Shares
  • 8.7 Worldwide LPCVD Market Shares
  • 8.8 Worldwide PVD Market Shares
  • 8.9 Worldwide ECD Market Shares
  • 8.10 ALD Applications a Share of Market
  • 8.11 Worldwide ALD Market Shares

TABLES

  • 8.1 Worldwide CVD Market Forecast
  • 8.2 Worldwide MCVD Market Shares
  • 8.3 Worldwide DCVD Market Shares
  • 8.4 Worldwide HDPCVD Market Shares
  • 8.5 Worldwide PECVD Market Shares
  • 8.6 Worldwide SACVD Market Shares
  • 8.7 Worldwide LPCVD Market Shares
  • 8.8 Worldwide PVD Market Forecast
  • 8.9 Worldwide PVD Market Shares
  • 8.10 Worldwide ECD Market Forecast
  • 8.11 Worldwide ALD Market Forecast
Description

[Report]
Thin Film Deposition: Trends, Key Issues, Market Analysis
Published: 2007/12
Published by : The Information Network The Information Network

Price:
US $ 2,495.00 PDF by E-mail
US $ 2,545.00 PDF by E-mail & Hard Copy
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Product Code : IF5774
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