Abstract
In 2006, China' s semiconductor packaging and testing industry shipment value
reached 51.2 billion RMB (US$6.8 billion; US$1 = 7.5 RMB). Although this was a
48.4% increase compared to 2005, IC packaging and testing only held a 50.8%
share of China' s IC industry compared to 74.3% in 2002. In 2007, while NXP,
Qimonda, Micron Semiconductor, Kingston Technology, and Samsung have invested
in China to construct new production lines or expand capacity, TI was choosing
between China and the Philippines and was likely to partner with the
Philippines government in the end. Chinese IC packaging and testing service
providers have been establishing strategic alliances to improve their
technologies and create new business opportunities. This report will analyze
the current status of the IC packaging and testing industry in China as well
as leading companies' opportunities and challenges.
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