Introduction to Printed Electronics

Table of Contents

EXECUTIVE SUMMARY AND CONCLUSIONS

1. INTRODUCTION

• 1.1. Definition and destination
  • 1.1.1. Background
  • 1.1.2. New concepts - rollable, origami and edible electronics
  • 1.1.3. Origami electronics
  • 1.1.4. Ubiquitous Sensor Networks
  • 1.1.5. Electronic packaging
  • 1.1.6. Conformal electronics/ electronic wallpaper
  • 1.1.7. Wearable and very portable electronics
  • 1.1.8. Old concepts revisited - fault tolerant electronics, hard programmed electronics
  • 1.1.9. Electronics without circuits
• 1.2. The technical needs for printed electronics
  • 1.2.1. Replacing and enhancing conventional print
  • 1.2.2. Replacing the silicon chip
  • 1.2.3. Replacing conventional displays
  • 1.2.4. Replacing conventional lighting
  • 1.2.5. Transforming the human interface and new forms of safety and security
  • 1.2.6. New forms of amusement and merchandising
  • 1.2.7. New forms of drug delivery
  • 1.2.8. Products that are light, rugged and extremely low cost
• 1.3. Smart locations
• 1.4. Industries that need to collaborate
• 1.5. Value chain and life beyond plastic electronics
• 1.6. Interim products with silicon chips
• 1.7. Impediments to printed electronics

2. PRINTABLE CIRCUIT ELEMENTS

• 2.1. Substrates
• 2.2. Conductors
  • 2.2.1. Choice of conductors
  • 2.2.2. Printing with inks - the options
  • 2.2.3. Progress with conductive inks
• 2.3. Semiconductors

3. COMPONENTS - LOGIC AND MEMORY

• 3.1. Logic
  • 3.1.1. Transistor design
  • 3.1.2. Benefits and applications envisaged for TFTCs in general
  • 3.1.3. Development path
  • 3.1.4. Company strategy and value chain
• 3.2. Memory

4. COMPONENTS - DISPLAYS, SIGNAGE AND LIGHTING

• 4.1. Displays
• 4.2. Non-emissive displays
  • 4.2.1. Thermochromic
  • 4.2.2. Electrochromic
  • 4.2.3. Electrophoretic
  • 4.2.4. Electrowetted displays
  • 4.2.5. Electrochemical displays on paper
• 4.3. Emissive displays
  • 4.3.1. AC Electroluminescent
  • 4.3.2. OLED

5. LIGHTING

• 5.1. AC electroluminescent lighting.
• 5.2. OLED lighting

6. COMPONENTS - POWER

• 6.1. Photovoltaics
• 6.2. Batteries
  • 6.2.1. Button batteries vs laminar batteries
  • 6.2.2. Choices of laminar battery
  • 6.2.3. Applications of laminar batteries
  • 6.2.4. Leeds Lithium Power
  • 6.2.5. Infinite Power Solutions
  • 6.2.6. Solicore, USA
  • 6.2.7. SCI Engineered Materials, USA
  • 6.2.8. Power Paper
  • 6.2.9. Thin Battery Technologies
  • 6.2.10. Printed battery research
• 6.3. Fuel cells

7. SENSORS

• 7.1. General situation and examples
• 7.2. Photodetector arrays
  • 7.2.1. Printed flexible scanners
  • 7.2.2. Nanoident - world' s first printed semiconductor factory

8. CO-DEPOSITED COMPONENTS

9. BROAD OVERVIEW OF TIMELINES AND MARKETS

• 9.1. General scenario to 2025
• 9.2. OLEDs
• 9.3. Ubiquitous Sensor Networks
• 9.4. Photovoltaics
• 9.5. Conductive patterns
• 9.6. Lighting

APPENDIX 1: IDTECHEX PUBLICATIONS

APPENDIX 2: GLOSSARY