ICs With Multiple Wireless Functionality - 2007 Edition

Table of Contents

Executive Summary

Chapter 1 - Introduction, Scope & Methodology

• 1.0 Introduction
• 1.1 Scope
• 1.2 Methodology
• 1.3 Report Content

Chapter 2 - Technology Review

• 2.0 Introduction
• 2.1 Bluetooth
  • 2.1.1 Introduction
  • 2.1.2 Technical Specification
  • 2.1.3 Standards Evolution
  • 2.1.4 Markets Served
• 2.2 UWB
  • 2.2.1 Introduction
  • 2.2.2 Technical Specification
  • 2.2.3 Standards Evolution
  • 2.2.4 Markets Served
• 2.3 WLAN
  • 2.3.1 Introduction
  • 2.3.2 Technical Specification
  • 2.3.3 Standards Evolution
  • 2.3.4 Markets Served
• 2.4 WiMax
  • 2.4.1 Introduction
  • 2.4.2 Technical Specification
  • 2.4.3 Standards Evolution
  • 2.4.4 Markets Served
• 2.5 GPS
  • 2.5.1 Introduction
  • 2.5.2 Technical Specification
  • 2.5.3 Standards Evolution
  • 2.5.4 Markets Served
• 2.6 NFC
  • 2.6.1 Introduction
  • 2.6.2 Technical Specification
  • 2.6.3 Standards Evolution
  • 2.6.4 Markets Served
• 2.7 Wibree
  • 2.7.1 Introduction
  • 2.7.2 Technical Specification
  • 2.7.3 Standards Evolution
  • 2.7.4 Markets Served
• 2.8 Technical Advantages of Combination ICs

Chapter 3 - The Supplier Industry and Competitive Environment

• 3.0 Introduction
• 3.1 Competitive Environment
  • 3.1.1 Bluetooth & FM
  • 3.1.2 UWB (Bluetooth 3.0 and Wireless USB)
  • 3.1.3 WLAN & WiMax
  • 3.1.4 GPS
  • 3.1.5 NFC
  • 3.1.6 Wibree
• 3.2 Summary of Technologies Addressed
• 3.3 Summary of Industry Body Involvement
• 3.4 Alereon
• 3.5 Artimi
• 3.6 Atheros
• 3.7 Atmel Corporation
• 3.8 Beceem Communications
• 3.9 Broadcom
• 3.10 Cambridge Silicon Radio (CSR)
• 3.11 Ezurio
• 3.12 Fujitsu Microelectronics
• 3.13 Infineon
• 3.14 Intel
• 3.15 Marvell
• 3.16 National Semiconductors
• 3.17 NemeriX
• 3.18 NXP (formerly Philips Semiconductor)
• 3.19 Omron Advanced Systems
• 3.20 Qualcomm
• 3.21 RedDot Wireless
• 3.22 Renesas
• 3.23 RF Magic
• 3.24 RF Micro Devices
• 3.25 Runcom Technologies
• 3.26 Sequans Communications
• 3.27 Sierre Monolithics
• 3.28 SIGe Semiconductor
• 3.29 SiRF Technology
• 3.30 Staccato Communications
• 3.31 STMicroelectronics
• 3.32 TDK Electronics Ireland Ltd.
• 3.33 TeleCIS Wireless
• 3.34 Texas Instruments (TI)
• 3.35 WaveSat
• 3.36 Wipro
• 3.37 WiQuest
• 3.38 Wisair
• 3.39 Zoran

Chapter 4 - Market Forecasts and Analysis

• 4.0 Introduction
• 4.1 Combination IC Forecasts
  • 4.1.1 Introduction
  • 4.1.2 Bluetooth Shipment Volumes
  • 4.1.3 Total Combination IC Shipments
  • 4.1.4 ASPs and Revenues
• 4.2 Secondary Combination ICs
• 4.3 Combination IC Forecasts by Application
  • 4.3.1 Cellular Handsets
    • 4.3.1.1 Individual Technologies
    • 4.3.1.2 Key Drivers for Combined ICs
    • 4.3.1.3 Market Forecasts and Assumptions
  • 4.3.2 PDAs
    • 4.3.2.1 Individual Technologies
    • 4.3.2.2 Key Drivers for Combined ICs
    • 4.3.2.3 Market Forecasts and Assumptions
  • 4.3.3 Notebook PCs
    • 4.3.3.1 Individual Technologies
    • 4.3.3.2 Key Drivers for Combined ICs
    • 4.3.3.3 Market Forecasts and Assumptions
  • 4.3.4 Add-in Cards and Dongles
    • 4.3.4.1 Individual Technologies
    • 4.3.5.2 Key Drivers for Combined ICs
    • 4.3.4.3 Market Forecasts and Assumptions
  • 4.3.5 Personal Media Players (PMPs)
    • 4.3.5.1 Individual Technologies
    • 4.3.5.2 Key Drivers for Combined ICs
    • 4.3.5.3 Market Forecasts and Assumptions
  • 4.3.6 Digital Cameras
    • 4.3.6.1 Individual Technologies
    • 4.3.6.2 Key Drivers for Combined ICs
    • 4.3.6.3 Market Forecasts and Assumptions
  • 4.3.7 Light Vehicles
    • 4.3.7.1 Individual Technologies
    • 4.3.7.2 Key Drivers for Combined ICs
    • 4.3.7.3 Market Forecasts and Assumptions

• 4.1 WW Market for Bluetooth ICs and Bluetooth-enabled End-equipment Shipped
• 4.2 WW Market for ICs with Multiple Wireless Functionality
• 4.3 WW Market for Combination IC ASPs
• 4.4 WW Market for Combination IC Revenues
• 4.5 WW Market for ICs with Multiple Wireless Functionality for Cellular Handsets
• 4.6 WW Market for Cellular Handsets using ICs with Multiple Wireless Functionality
• 4.7 Handsets with Bluetooth ICs vs. Handsets with Combination Bluetooth ICs
• 4.8 WW Market for WiMax/WLAN ICs for Cellular Handsets
• 4.9 WW Market for ICs with Multiple Wireless Functionality for PDAs
• 4.10 WW Market for PDAs using ICs with Multiple Wireless Functionality
• 4.11 WW Market for ICs with Multiple Wireless Functionality for Notebooks
• 4.12 WW Market for Notebooks using ICs with Multiple Wireless Functionality
• 4.13 Notebook PCs with WLAN ICs vs. Notebook PCs with Combination WLAN ICs
• 4.14 WW Market for WiMax/WLAN ICs for Notebook PCs
• 4.15 WW Market for ICs with Multiple Wireless Functionality for Add-in Cards & Dongles
• 4.16 WW Market for Add-in Cards & Dongles using ICs with Multiple Wireless Functionality
• 4.17 WW Market for WiMax/WLAN ICs for Add-in Cards & Dongles
• 4.18 WW Market for ICs with Multiple Wireless Functionality for PMPs
• 4.19 WW Market for PMPs using ICs with Multiple Wireless Functionality
• 4.20 WW Market for ICs with Multiple Wireless Functionality for Digital Cameras
• 4.21 WW Market for Digital Cameras using ICs with Multiple Wireless Functionality
• 4.22 WW Market for ICs with Multiple Wireless Functionality for Light Vehicles
• 4.23 WW Market for Light Vehicles using ICs with Multiple Wireless Functionality

• 4.1 WW Market for Bluetooth ICs and Bluetooth-enabled End-equipment Shipped
• 4.2 WW Market for ICs with Multiple Wireless Functionality
• 4.3 WW Market for ICs with Multiple Wireless Functionality
• 4.4 WW Market for ICs with Multiple Wireless Functionality for Cellular Handsets
• 4.5 Handsets with Bluetooth ICs vs. Hansets with Combination Bluetooth ICs
• 4.6 WW Market for ICs with Multiple Wireless Functionality for PDAs
• 4.7 WW Market for ICs with Multiple Wireless Functionality for Notebooks
• 4.8 Notebook PCs with WLAN ICs vs. Notebook PCs with Combination WLAN ICs
• 4.9 WW Market for ICs with Multiple Wireless Functionality for Add-in Cards & Dongles
• 4.10 WW Market for ICs with Multiple Wireless Functionality for PMPs
• 4.11 WW Market for ICs with Multiple Wireless Functionality for Digital Cameras
• 4.12 WW Market for ICs with Multiple Wireless Functionality for Light Vehicles