The Worldwide Market for Semiconductors and Software in Set-Top Boxes - 2007 Edition

Table of Contents

• 1.1 Scope
  • 1.1.1 Product Definition
  • 1.1.2 Objectives
  • 1.1.3 Report Content
  • 1.1.4 Quantitative Breakdowns
• 1.2 Methodology
  • 1.2.1 Information Sources
  • 1.2.2 Forecasting Methodology

• 2.1 Set-top Box Product Mix
  • 2.1.1 Set-top Box Feature Class Definitions
  • 2.1.2 Set-top Box Product Mix by Feature Class
  • 2.1.3 Set-top Shipments by Feature Class, Platform, & Broadcast Standard
  • 2.1.4 Set-top Box Prices and Revenues
• 2.2 Set-top Box Installed Base
  • 2.2.1 STB Installed Base and Net Adds
  • 2.2.2 Set-top Boxes Per Household
• 2.3 The Influence of Video Codec & Broadcast Modulation Standards
  • 2.3.1 Video Codec Standards
  • 2.3.2 Audio Codec Standards
  • 2.3.3 Conditional Access
  • 2.3.4 Broadcast Modulation Standards
• 2.4 Emerging Customer Needs
  • 2.4.1 Digital Rights Management (DRM)
  • 2.4.2 Home Media Networking
  • 2.4.3 Place Shifting
  • 2.4.4 Transcoding
• 2.5 Government Intervention in STB Tech
  • 2.5.1 Separable CAS in US Cable (7-07)
  • 2.5.2 HDTV A/V Out Mandates in the US
  • 2.5.3 MPEG-4 AVC HDTV DTT in France
  • 2.5.4 Government Mandated Middleware

• 3.1 RF Front Ends (Tuners & Demods)
  • 3.1.1 RF Tuners
  • 3.1.2 RF Demodulators
  • 3.1.3 Servers 3 or More Video Tuners
  • 3.1.4 RF Front Ends Installed in STBs
  • 3.1.5 Satellite
  • 3.1.6 Cable
  • 3.1.7 Digital Terrestrial
  • 3.1.8 DSL Modems (IPTV)
  • 3.1.9 Regional Trends
• 3.2 Video Decoders
  • 3.2.1 Long-term Trends
  • 3.2.2 Single-stream vs. Multi-Stream STBs
  • 3.2.3 Single-decode vs. Dual-Decode DVRs
  • 3.2.4 Video Codec Standards in STBs
  • 3.2.5 Audio Codec Standards in STBs
• 3.3 CAS Smartcard and Module Interfaces
  • 3.3.1 CAS in Free-to-Air
  • 3.3.2 Separable Conditional Access in US Cable (7-07)
  • 3.3.3 Advanced Hardware Security
  • 3.3.4 CAS Card & Module Interfaces Installed in Set-top Boxes
• 3.4 Applications Processing, Graphics, Memory, and HDD Interfaces
  • 3.4.1 Embedded Applications Processors
  • 3.4.2 DRAM
  • 3.4.3 Flash
  • 3.4.4 Graphics Processors (Blitters)
  • 3.4.5 Hard Disk Drive Buses
• 3.5 Hard Disk Drives in DVRs
  • 3.5.1 Effects of Large HDD Size
• 3.6 A/V Outputs
  • 3.6.1 SD Video Outputs
  • 3.6.2 HD & Digital Video Outputs
  • 3.6.3 Audio Outputs
• 3.7 Digital I/O
  • 3.7.1 Wide-Area Network Modems
  • 3.7.2 Local-Area Network Interfaces
  • 3.7.3 High Speed Serial and Other Peripheral Interfaces
• 3.8 Power Supplies
• 3.9 Bill of Materials Pricing and Revenue
  • 3.9.1 Other Costs & Gross Margin
  • 3.9.2 Front Ends
  • 3.9.3 Core MPEG Decoder Chips
  • 3.9.4 DRAM
  • 3.9.5 Flash NVRAM
  • 3.9.6 Hard Disk Drives
  • 3.9.7 CAS Interface Hardware
  • 3.9.8 A/V Output Port Semis (Back End)
  • 3.9.9 WAN Modems
  • 3.9.10 LAN Interfaces
  • 3.9.11 Power & Other Semiconductors
  • 3.9.12 Regional Trends

• 4.1 Key Trends
• 4.2 Operating Systems
  • 4.2.1 Factory OS Installations
• 4.3 Interactive Middleware
  • 4.3.1 Commercial Middleware APIs
  • 4.3.2 Open Standards
  • 4.3.3 IPTV Middleware

• 5.1 Conditional Access Vendors
• 5.2 CAS Vendor Market Shares
  • 5.2.1 Americas
  • 5.2.2 Asia Pacific
  • 5.2.3 Europe, the Middle-East, & Africa