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[Report]

Nanotechnology in Wireless Handsets

Published: 2008/03

Contact 24 hrs/day
Description

Table of Contents

Chapter One: Executive Summary

Chapter Two: Introduction to Nanotechnology

  • 2.1 Definition and Introduction
  • 2.2 History of Nanotechnology
  • 2.3 Drivers
    • 2.3.1 Portability
    • 2.3.2 Miniaturization
    • 2.3.3 Power Efficiency
    • 2.3.4 Consistent ROI
  • 2.4 Limitations, Challenges and Constraints for Nanotechnology
  • 2.5 Roleof MEMS as a Facilitator for Nanotechnology Adoption in Wireless Handsets
  • 2.6 Areasof Focus
  • 2.7 Conclusions

Chapter Three: Contemporary Manufacturing Process,Challenges and Innovations

  • 3.1 Stepsin Manufacturing
    • 3.1.1 Design
    • 3.1.2 Fabrication
    • 3.1.3 Packaging and Assembly
    • 3.1.4 Testing
  • 3.2 Overview of the Major Functions of Wireless Devices
  • 3.3 Why is the Handset so Special?
  • 3.4 CostAnalysis of Wireless Handset Components
  • 3.5 Contemporary Architecture Scheme for the Wireless Handsets
  • 3.6 Existing Technologies for Handset Components
    • 3.6.1 Antennas
    • 3.6.2 RFComponents
    • 3.6.3 Memory
    • 3.6.4 Processors
    • 3.6.5 Displays
    • 3.6.6 Batteries
  • 3.7 Conclusions

Chapter 4: Nanotechnology and MEMS: Relevant Materials and Processes for Wireless Applications

  • 4.1 Carbon Nano-Tubes (CNT)
    • 4.1.1 Introduction
    • 4.1.2 The Fullerene and Buckyball Family
    • 4.1.3 Methods of Synthesis
    • 4.1.4 CNT Alignments
    • 4.1.5 Characteristics, Features and Other Details
    • 4.1.6 Wireless Applications
      • 4.1.6.1 RF Component Applications
      • 4.1.6.2 Battery Applications
  • 4.2 Spintronics
    • 4.2.1 Introduction
    • 4.2.2 Characteristics
    • 4.2.3 Features and innovations
    • 4.2.4 Wireless Applications
  • 4.3 Quantum Dots
    • 4.3.1 Introduction
    • 4.3.2 Methods of Synthesis
    • 4.3.3 Characteristics
    • 4.3.4 Wireless Applications
      • 4.3.4.1 Quantum Dot LED (QD-LED)
      • 4.3.4.2 Non-Volatile Memory
      • 4.3.4.3 Computing Applications
  • 4.4 MEMS value additions
    • 4.4.1 RFComponents
    • 4.4.2 Display
  • 4.5 Conclusions

Chapter Five: Application of Nanotechnology in Wireless Applications and Devices

  • 5.1 Antennas
    • 5.1.1 CNT Based Antennas
    • 5.1.2 MEMS Improvement Based Enhanced Antennas
  • 5.2 RF Components
    • 5.2.1 FBAR Duplexers
    • 5.2.2 BAW Filters
  • 5.3 Memory
    • 5.3.1 NRAM
    • 5.3.2 MRAM
    • 5.3.3 Molecular Memory
    • 5.3.4 Ovonic Memory
  • 5.4 Processors
    • 5.4.1 CNT Based Processors
  • 5.5 Batteries
    • 5.5.1 Fuel Cells
  • 5.6 Displays
    • 5.6.1 OLED
    • 5.6.2 SED
  • 5.7 Conclusions

Chapter Six: Stakeholder Analysis

  • 6.1 Niche Experts
    • 6.1.1 Introduction and Features
    • 6.1.2 Case Studies
      • 6.1.2.1 Ambit Corporation
        • 6.1.2.1.1 Nanotechnology Initiatives
        • 6.1.2.1.2 Other Salient Details
        • 6.1.2.1.3 Analysis and Implications
      • 6.1.2.2 BatMax Corporation
        • 6.1.2.2.1 Nanotechnology Initiatives
        • 6.1.2.2.2 Other Salient Details
        • 6.1.2.2.3 Analysis and Implications
      • 6.1.2.3 Discera
        • 6.1.2.3.1 Nanotechnology Initiatives
        • 6.1.2.3.2 Other Salient Details
        • 6.1.2.3.3 Analysis and Implications
      • 6.1.2.4 Explay
        • 6.1.2.4.1 Nanotechnology Initiatives
        • 6.1.2.4.2 Other Salient Details
        • 6.1.2.4.3 Analysis and Implications
      • 6.1.2.5 Nanosys
        • 6.1.2.5.1 Nanotechnology Initiatives
        • 6.1.2.5.2 Other Salient Details
        • 6.1.2.5.3 Analysis and Implications
      • 6.1.2.6 Nantero
        • 6.1.2.6.1 Nanotechnology Initiatives
        • 6.1.2.6.2 Other Salient Details
        • 6.1.2.6.3 Analysis and Implications
      • 6.1.2.7 Poly Fuel
        • 6.2.1.7.1 Nanotechnology Initiatives
        • 6.1.2.7.2 Other Salient Details
        • 6.1.2.7.3 Analysis and Implications
      • 6.1.2.8 ZettaCore
        • 6.1.2.8.1 Nanotechnology Initiatives
        • 6.1.2.8.2 Other Salient Details
        • 6.1.2.8.3 Analysis and Implications
  • 6.2 End Equipment Developers
    • 6.2.1 Introduction and Features
    • 6.2.2 Case Studies
      • 6.2.2.1 Motorola
        • 6.2.2.1.1 Nanotechnology Initiatives
        • 6.2.2.1.2 Other Salient Details
        • 6.2.2.1.3 Analysis and Implications
      • 6.2.2.2 Nokia
        • 6.2.2.2.1 Nanotechnology Initiatives
        • 6.2.2.2.2 Other Salient Details
        • 6.2.2.2.3 Analysis and Implications
  • 6.3 Intermediate Component Specialists
    • 6.3.1 Introduction and Features
    • 6.3.2 Case Studies
      • 6.3.2.1 Avago Technologies
        • 6.3.2.1.1 Nanotechnology Initiatives
        • 6.3.2.1.2 Other Salient Details
        • 6.3.2.1.3 Analysis and Implications
      • 6.3.2.2 Freescale
        • 6.3.2.2.1 Nanotechnology Initiatives
        • 6.3.2.2.2 Other Salient Details
        • 6.3.2.2.3 Analysis and Implications
      • 6.3.2.3 IBM
        • 6.3.2.3.1 Nanotechnology Initiatives
        • 6.3.2.3.2 Other Salient Details
        • 6.3.2.3.3 Analysis and Implications
      • 6.3.2.4 Intel
        • 6.3.2.4.1 Nanotechnology Initiatives
        • 6.3.2.4.2 Other Salient Details
        • 6.3.2.4.3 Analysis and Implications
      • 6.3.2.5 Samsung
        • 6.3.2.5.1 Nanotechnology Initiatives
        • 6.3.2.5.2 Other Salient Details
        • 6.3.2.5.3 Analysis and Implications
      • 6.3.2.6 Sony Corporation
        • 6.3.2.6.1 Nanotechnology Initiatives
        • 6.3.2.6.2 Other Salient Details
        • 6.3.2.6.3 Analysis and Implications
  • 6.4 Independent Research Institutes
    • 6.4.1 Introduction and Features
    • 6.4.2 Case Studies
      • 6.4.2.1 IMEC
        • 6.4.2.1.1 Nanotechnology Initiatives
        • 6.4.2.1.2 Other Salient Details
        • 6.4.2.1.3 Analysis and Implications
      • 6.4.2.2 Universities and Academic Institutes
  • 6.5 Concept Developers
    • 6.5.1 Introduction and Features
    • 6.5.2 Case Studies
      • 6.5.2.1 ARM
        • 6.5.2.1.1 Nanotechnology Initiatives
        • 6.5.2.1.2 Other Salient Details
        • 6.5.2.1.3 Analysis and Implications
  • 6.6 Conclusion

Chapter Seven: Quantitative Analysis and Forecasts

  • 7.1 Description of Research Methodology
    • 7.1.1 Obtaining the Base Data for Wireless Handset Shipments
    • 7.1.2 Using the Base Data to Calculate the Market Size for Nanotechnology Enabled Components
    • 7.1.3 Pre-analysis Hypotheses for Regional Distribution
    • 7.1.4 Pre-Analysis Hypotheses for Pricing and Shipment Penetration Ratios
  • 7.2 Individual Wireless Applications and Devices Analysis
    • 7.2.1 Antennas
      • 7.2.1.1 Market Size and Time-Frame for Introduction of Nanotechnology Processes and Materials
      • 7.2.1.2 Regional Share
    • 7.2.2 RF components
      • 7.2.2.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
      • 7.2.2.2 Regional Share
    • 7.2.3 Memory
      • 7.2.3.1 Market Size and Time-Frame for Introduction of Nanotechnology Processes and Materials
      • 7.2.3.2 Regional Share
    • 7.2.4 Processors
      • 7.2.4.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
      • 7.2.4.2 Regional Share
    • 7.2.5 Displays
      • 7.2.5.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
      • 7.2.5.2 Regional Share
    • 7.2.6 Batteries
      • 7.2.6.1 Market Size and Time-frame for Introduction of Nanotechnology Processes and Materials
      • 7.2.6.2 Regional Share
  • 7.3 Conclusions

Chapter Eight: Epilogue

  • Glossary: List of Acronyms

List of Exhibits

Chapter One: Executive Summary

  • Exhibit 1.1: Individual Component Contribution Ranges for the Wireless Handset BoM
  • Exhibit 1.2: Wireless Handset Enhancement Summary
  • Exhibit 1.3: Timelines and Market Size for Nanotechnology Enabled Handset Components
  • Exhibit 1.4: Timelines and Market Size for Nanotechnology Enabled Handset Components (table)
  • Exhibit 1.5: Nanotechnology Enabled Wireless Handset Component Stakeholder Value Chain
  • Exhibit 1.6: Benefit-ChallengeAnalysis for Nanotechnology Enabled Wireless Handset Components
  • Exhibit 1.7: Stakeholder Classification and Activity Summary

Chapter Two: Introduction to Nanotechnology1

  • Exhibit 2.1: Existing and Projected Advances in Semiconductor Manufacturing

Chapter Three: Contemporary Manufacturing Process, Challenges andInnovations

  • Exhibit 3.1: CMOS GateSchematic
  • Exhibit 3.2: 65 nm ProcessTransistor
  • Exhibit 3.3: 45 nm Technology from AMD
  • Exhibit 3.4: 32 nm Based SRAM TestChip from Intel
  • Exhibit 3.5: Bottom View of a Chip with BGA7
  • Exhibit 3.6: FC Bonding
  • Exhibit 3.7: RF SiP
  • Exhibit 3.8: PoP of Application Processor and DRAM
  • Exhibit 3.9: Individual Component Contribution Ranges for the Wireless Handset BoM
  • Exhibit 3.10: Functional Blocks of the Mobile Phone
  • Exhibit 3.11: The Sky Cross EM-1800-1900 Mobile Phone Antenna Element Along with the Mobile Phone PCB
  • Exhibit 3.12: Mobile PhoneStorage Memory
  • Exhibit 3.13: SanDisk 1GB Micro SD
  • Exhibit 3.14: The PXA300 Application Processor from Marvell
  • Exhibit 3.15: The HTC Touch Phone with Interactive Display
  • Exhibit 3.16: The Giorgio Armani Mobile Phone with a 2.6 Inch TFT LCD Screen
  • Exhibit 3.17: Nokia B-4C Li-IonBattery
  • Exhibit 3.18: Charging and Discharging of a Li-ion Battery

Chapter 4: Nanotechnology and MEMS: Relevant Materials and Processes for Wireless Applications

  • Exhibit 4.1: Arrangement of Carbon Atoms in a Buckyball
  • Exhibit 4.2: Block Diagram of CVD
  • Exhibit 4.3: CNT Alignments
  • Exhibit 4.4: Schematic Representation of CNT Alignments5
  • Exhibit 4.5: Energy Saving Potential of Spintronics
  • Exhibit 4.6: 20 nm Wide and 8 nmTall Quantum Dots
  • Exhibit 4.7: Construction of aQD-LED
  • Exhibit 4.8: A Schematic Representation of QC
  • Exhibit 4.9: MEMS Capacitor Developed by Philips Used in RF Applications
  • Exhibit 4.10: Summary ofApplications of Nanotechnology and MEMS in Wireless Handset Components

Chapter Five: Application of Nanotechnology in Wireless Applications and Devices

  • Exhibit 5.1: Schematic Representation of FBAR
  • Exhibit 5.2: Duplexers from Avago Aimed at PCS and WCDMA Technologies
  • Exhibit 5.3: Block Diagram ofBAW Filter Used in a Quad-Band Transceiver from NXP
  • Exhibit 5.4: Schematic of MRAM Read/Write Operations
  • Exhibit 5.5: Cross Section of MRAM Developed by IBM
  • Exhibit 5.6: STM Image of Highly Ordered Molecular Wire
  • Exhibit 5.7: Schematic of FET Using CNT
  • Exhibit 5.8: The Potential of CNT Induced Value Addition in Present Day Semiconductor Processes
  • Exhibit 5.9: Chemical Reaction Driving the Fuel Cell
  • Exhibit 5.10: OLED Layers
  • Exhibit 5.11: MotoROKR U9 with OLED External Display
  • Exhibit 5.12: The Sony Ericsson Seesaw Concept Phone with OLED Principal Display
  • Exhibit 5.13: Wireless Handset Enhancement Summary
  • Exhibit 5.14: Benefit-Challenge Analysis for Nanotechnology Enabled Wireless Handset Components

Chapter Six: Stakeholder Analysis

  • Exhibit 6.1: Micro Porous Crystalline Solids
  • Exhibit 6.2: Block Diagram of a Battery Powered by BatMax IonXR2
  • Exhibit 6.3: BatMax Foils for Mobile Phones
  • Exhibit 6.4: DisceraDisk-Wineglass Oscillator Used for RF Oscillator Functions
  • Exhibit 6.5: The Explay Nano-Projector
  • Exhibit 6.6: Block Diagram of Explay Nano-Projector Engine
  • Exhibit 6.7: Schematic of NRAM
  • Exhibit 6.8: NRAM Switching Circuitry
  • Exhibit 6.9: Advantages of PolyFuel Membrane as Opposed to Fluorocarbon Membrane
  • Exhibit 6.10: Components of the Molecular Memory Array Synthesized by Zetta Core
  • Exhibit 6.11: Nanotubes in IC Fabrication
  • Exhibit 6.12: Functional Block Diagram of ACMD-7601
  • Exhibit 6.13: Block Diagram of MR2A16A
  • Exhibit 6.14: Intra-Molecular Logic Performing Computer Circuit
  • Exhibit 6.15: 64 Gigabyte Multi-Level Cell Flash Memory from Samsung
  • Exhibit 6.16: IMEC Engagement Model
  • Exhibit 6.17: ARM and Partner Interplay for Nokia N95 Handset Design
  • Exhibit 6.18: Revenue Streams and Business Model of ARM
  • Exhibit 6.19: ARM Cumulative Physical IP Licenses
  • Exhibit 6.20: Nanotechnology Enabled Wireless Handset Component Stakeholder Value Chain
  • Exhibit 6.21: Stakeholder Classification and Activity Summary

Chapter Seven: Quantitative Analysis and Forecasts1

  • Exhibit 7.1: Methodology for Obtaining Base Data for Handset Shipments
  • Exhibit 7.2: Methodology for Obtaining Market Size for Yet-to-Be-Launched Nanotechnology Enabled Wireless Handset Components
  • Exhibit 7.3: Methodology for Obtaining Market Size of Commercially Available Nanotechnology-Enabled Wireless Handset Components
  • Exhibit 7.4: Market for Nanotechnology Enabled Wireless Handset Antennas (2010-2012) (million)
  • Exhibit 7.5: Regional Distribution of Nanotechnology Enabled Wireless Handset Antennas (2010-2012)(million)
  • Exhibit 7.6: Regional Share of Nanotechnology Enabled Wireless Handset Antennas (2010-2012) (%)
  • Exhibit 7.7: Market for Nanotechnology Enabled Wireless Handset RF Components (2007-2012) (million)
  • Exhibit 7.8: Regional Distribution of Nanotechnology Enabled Wireless Handset RF Components (2007-2012)(million)
  • Exhibit 7.9: Regional Share of Nanotechnology Enabled Wireless Handset RF Components (2007-2012) (%)
  • Exhibit 7.10: Market for Nanotechnology Enabled Wireless Handset Memory (2009-2012) (million)
  • Exhibit 7.11: Regional Distribution of Nanotechnology Enabled Wireless Handset Memory (2009-2012)(million)
  • Exhibit 7.12: Regional Share of Nanotechnology Enabled Wireless Handset Memory (2009-2012) (%)
  • Exhibit 7.13: Market for Nanotechnology Enabled Wireless Handset Processors (2010-2012) (million)
  • Exhibit 7.14: Regional Distribution of Nanotechnology Enabled Wireless Handset Processors (2010-2012)(million)
  • Exhibit 7.15: Regional Share of Nanotechnology Enabled Wireless Handset Processors (2010-2012) (%)
  • Exhibit 7.16: Market for Nanotechnology Enabled Wireless Handset Displays (2007-2012) (million)
  • Exhibit 7.17: Regional Distribution of Nanotechnology Enabled Wireless Handset Displays (2007-2012)(million)
  • Exhibit 7.18: Regional Share of Nanotechnology Enabled Wireless Handset Displays (2007-2012) (%)
  • Exhibit 7.19: Market for Nanotechnology Enabled Wireless Handset Batteries (2009-2012) (million)
  • Exhibit 7.20: Regional Distribution of Nanotechnology Enabled Wireless Handset Batteries (2009-2012)(million)
  • Exhibit 7.21: Regional Share of Nanotechnology Enabled Wireless Handset Batteries (2009-2012) (%)
  • Exhibit 7.22: Timelines and Market size for Nanotechnology Enabled Handset Components
Description

[Report]
Nanotechnology in Wireless Handsets
Published: 2008/03
Published by : Pioneer Consulting Pioneer Consulting

Price:
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US $ 2,950.00 PDF by E-mail (Single User License)
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Product Code : PC63956
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