Unattended Ground Sensors: Communications Technologies and Markets

Table of Contents

1.0 Introduction

• 1.1 General
• 1.1.1 DARPA
  • 1.1.2 IEEE
  • 1.1.3 Details
• 1.2 UWB
  • 1.2.1 Brief Description
• 1.3 ZigBee
• 1.4 UGS-based WSN
  • 1.4.1 Unattended Ground Sensors (UGS)
• 1.5 Scope
• 1.6 Structure
• 1.7 Research Methodology
• 1.8 Target Audience

2.0 UWB: Technology and Market Specifics

• 2.1 General
  • 2.1.2 History
  • 2.1.3 Obstacles
• 2.2 Definition
  • 2.2.1 Rates
• 2.3 Spectrum Allocation
  • 2.3.1 Choices
• 2.4 Major Features
  • 2.4.1 Communications Features
• 2.5 Standards and Regulations
  • 2.5.1 Multiband OFDM
  • 2.5.2 DS-UWB
  • 2.5.3 Standards Bodies
  • 2.5.4 Groups
  • 2.5.4.1 Forces
  • 2.5.5 FCC and ETSI
  • 2.5.6 ECMA International
  • 2.5.7 Ofcom and Others
  • 2.5.8 Comparison
    • 2.5.8.1 Impulse Radio- Pulse Link, Time Domain
    • 2.5.8.2 DS-CDMA - Motorola and other
    • 2.5.8.3 Multi-Band OFDM (FH) - MBOA
• 2.6 Applications
  • 2.6.1 General
  • 2.6.2 Home Security-UGS
  • 2.6.3 Phones
  • 2.6.4 RFID
  • 2.6.5 Communications and Imaging
  • 2.6.6 WPAN
  • 2.6.7 Imaging systems
  • 2.6.8 Vehicular radar systems
  • 2.6.9 Ranging
  • 2.6.10 Public Safety
• 2.7 WSN-UGS and UWB
  • 2.7.1 General
  • 2.7.2 Details
    • 2.7.2.1 WSN-UGS
    • 2.7.2.2 Requirements
    • 2.7.2.3 UWB Role
      • 2.7.2.3.1 UWB-structured WSN-UGS
      • 2.7.2.3.2 Features
  • 2.7.3 WSN-UGS: Examples
• 2.8 Issues
• 2.9 Applications Summary
• 2.10 UWB Market
  • 2.10.1 General
    • 2.10.1.1 Major Segments
  • 2.10.2 Forecast
  • 2.10.3 Notes on Market for UWB WSN-UGS
• 2.11 Industry: UWB and WSN
  • Aether Wire & Location (localization devices)
  • Alereon (chipsets)
  • Artimi (chipsets)
  • BBN (radio, first responders)
  • Camero (radar, equipment for first responders)
  • decaWave (chipsets)
  • Focus Enhancement (chipsets)
  • Freescale (chipsets, systems)
  • General Atomics (chipsets)
  • Multispectral (RFID and others)
  • Parco (RFID-Health Care)
  • Pulse˜ Link (chipsets)
  • Staccato (chipsets)
  • TriQuint (chipsets - homeland security applications)
  • Time Domain (chipsets-fusion of communications & radar)
  • Tzero (chipsets)
  • Ubisense (RFID-tracking)
  • Wisair (chipsets)
  • WiQuest (chipsets)

3.0 ZigBee

• 3.1 General
• 3.2 Technology
  • 3.2.1 Major Features
  • 3.2.2 Device Types
  • 3.2.3 Protocol Stack
    • 3.2.3.1 Physical and MAC layers - IEEE802.15.4
      • 3.2.3.1.1 Frame
    • 3.2.3.2 Upper Layers
      • 3.2.3.2.1 Interoperability
      • 3.2.3.2.2 Security
  • 3.2.4 Platform Considerations
    • 3.2.4.1 Battery Life
  • 3.2.5 ZigBee Technology Benefits and Limitations
• 3.3 Standardization Process
  • 3.3.1 ZigBee Alliance
    • 3.3.1.1 Objectives
  • 3.3.2 802.15.4- ZigBee Basis
    • 3.3.2.1 IEEE 802.15.4 Radio
    • 3.3.2.2 Application Specifics
• 3.4 Applications
  • 3.4.1 General
  • 3.4.2 Home
    • 3.4.2.1 PC
  • 3.4.3 Manufacturing
  • 3.4.4 WSN-UGS and ZigBee
    • 3.4.4.1 General
    • 3.4.4.2 Structure
      • 3.4.4.2.1 ZigBee Role
      • 3.4.4.2.2 ZigBee-structured WSN-UGS
• 3.5. Market
  • 3.5.1 Expectations
  • 3.5.2 Segments
  • 3.5.3 Forecast
• 3.6 Industry
  • Airbee (Software)
  • Amber (RF Systems)
  • Atmel (Chipsets)
  • Chipcon - TI (Chipsets)
  • Cirronet (Modules)
  • Crossbow (WSN, motes)
  • Duolog (Transceivers)
  • Eazix (Modules)
  • Ember (Chipsets)
  • Falcom (Modules)
  • Helicomm (Modules)
  • Jennic (Chipsets-Modules)
  • Freescale (Chipsets)
  • Luxoft Labs (Integration)
  • M&R Lawugger GmbH (Software)
  • Maxstream (WSN Modules)
  • Moteiv (Modules, SW)
  • vNanotron (Chipsets)
  • Oki (Chipsets)
  • Renesas (Platforms)
  • Silicon Laboratories (Chipsets, Modules)
  • Synapse
  • Telegesis (Integrator)
  • Ubiwave (Mesh Network)
  • Uniband (Chipsets)
  • ZMD (Chipsets)

4.0 Competition Landscape

• 4.1 Climate of Competition
  • 4.1.1 Bluetooth and ZigBee
  • 4.1.1.1 Air Interface
  • 4.1.1.2 Battery Drain
  • 4.1.1.3 Timing Considerations

5.0 UGS Technology- Specifics and Applications

• 5.1 Smart Sensor Structure
• 5.2 Networking
• 5.3 UGS Functioning
  • 5.3.1 Type
  • 5.3.2 Details
    • 5.3.2.1 Packaging and Categories
  • 5.3.3 Future Combat Systems
    • 5.3.3.1 Subgroups
    • 5.3.3.1.1 Tactical Subgroup
    • 5.3.3.1.2 Urban/MOUT Advanced Sensor Systems
  • 5.3.4 Intelligent Munitions System (IMS)
• 5.4 Standardization: IEEE 1451
  • 5.4.1 General
  • 5.4.2 Family
  • 5.4.3 Description
• 5.5 Applications
  • 5.5.1 General
  • 5.5.2 Applications Examples
    • 5.5.2.1 Military Example: REMBASS Family
    • 5.5.2.2 Military: Future
• 5.6 CHALLENGIES
• 5.7Market: Military

6.0 UGS Vendors

• BBN
• Crossbow (WSN)
• Crane (WSN-ZigBee)
• Dust Networks (USG-Mesh)
• Intel (Chipsets)
• Harris (UGS)
• IWT (Mesh)
• L3 (UGS)
• McQ (UGS)
• MeshDynamics (Mesh)
• Millennial Net (Mesh-UGS)
• Moteiv (WSN)
• MeshNetics (WSN Software)
• NRL (UGS)
• NorthropGrumman (UGS)
• Octave Technologies (SW, WSN)
• Plextek (Communications Platform for UGS)
• Rheinmetall (UGS)
• Selex (UGS)
• Sensicast (WSN)
• Strix (Mesh)
• Telonics
• Models
• TextRon (UGS)
• Thales (UGS)
• Trident (UGS-UWB)
• Zeltech

7.0 Conclusions

FIGURES:

• Figure 1: UWB Spectrum
• Figure 2: WSN-UGS Node
• Figure 3: WSN-UGS and UBW
• Figure 4: Market Estimate: UWB Circuitry ($B)
• Figure 5: Market Estimate: Multiband OFDM UWB Circuitry ($B)
• Figure 6: Market Estimate: DS UWB Circuitry ($B)
• Figure 7: Estimate of UWB Market - Communications Applications ($B)
• Figure 8: WSN-UGS Market Developing: Worldwide ($M)
• Figure 9: ZigBee Protocol Stack
• Figure 10: Node Structure
• Figure 11: Estimate: ZigBee Chipsets Market Worlwide ($M)
• Figure 12: ZigBee Market Segmentation (2006)
• Figure 13: ZigBee Market Segmentation (2010)

TABLES:

• Table 1: Comparison: Conventioanl Ad Hoc Network and WSN
• Table 2: Comparison: DS-UWB and MB-OFDM
• Table 3: FCC Emission Limits
• Table 4: UWB Applications: Summary
• Table 5: UWB Market Segments
• Table 6: ZigBee Parameters
• Table 7: Comparison