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[Report]

High-speed WPAN: Technology and Market Development

Published: 2007/11

Contact 24 hrs/day
Description

Table of Contents

1.0 Introduction

  • 1.1 Goal
  • 1.2 UWB
  • 1.3 IEEE 802.11n
  • 1.4 60 GHz Radio
    • 1.4.1 Specifics
  • 1.5 Report Structure
  • 1.6 Research Methodology
  • 1.7 Target Audience

2.0 WPAN and IEEE 802.15.3

3.0 UWB: Technology and Market Specifics

  • 3.1 General
    • 3.1.2 History
    • 3.1.3 Obstacles
  • 3.2 Definition
    • 3.2.1 Rates
  • 3.3 Spectrum Allocation
    • 3.3.1 Choices
  • 3.4 Major Features
    • 3.4.1 Communications Features
  • 3.5 Standards and Regulations
    • 3.5.1 Multiband OFDM
    • 3.5.2 DS-UWB
    • 3.5.3 Standards Bodies
    • 3.5.4 Groups
      • 3.5.4.1 Forces
    • 3.5.5 FCC and ETSI
    • 3.5.6 ECMA International
    • 3.5.7 Ofcom and Others
    • 3.5.8 Comparison
      • 3.5.8.1 Impulse Radio- Pulse Link, Time Domain
      • 3.5.8.2 DS-CDMA - Motorola and other
      • 3.5.8.3 Multi-Band OFDM (FH) - MBOA
  • 3.6 Applications
    • 3.6.1 General
    • 3.6.2 Home Security-UGS
    • 3.6.3 Phones
    • 3.6.4 RFID
    • 3.6.5 Communications and Imaging
    • 3.6.6 WPAN
    • 3.6.7 Imaging systems
    • 3.6.8 Vehicular radar systems
    • 3.6.9 Ranging
    • 3.6.10 Public Safety
  • 3.7 Issues
  • 3.8 Applications Summary
  • 3.9 UWB Market
    • 3.9.1 General
      • 3.9.1.1 Major Segments
    • 3.9.2 Forecast
  • 3.10 Industry
    • Aether Wire & Location (localization devices)
    • Alereon (chipsets)
    • Artimi (chipsets)
    • BBN (radio, first responders)
    • Camero (radar, equipment for first responders)
    • decaWave (chipsets)
    • Focus Enhancement (chipsets)
    • Freescale (chipsets, systems)
    • General Atomics (chipsets)
    • Multispectral (RFID and others)
    • Parco (RFID-Health Care)
    • Pulse~ Link (chipsets)
    • Philips
    • Radiospire (HDTV)
    • Realtek
    • Staccato (chipsets)
    • TriQuint (chipsets - homeland security applications)
    • Time Domain (chipsets-fusion of communications & radar)
    • Tzero (chipsets)
    • Ubisense (RFID-tracking)
    • Wisair (chipsets)
    • WiQuest (chipsets)

4.0 802.11n Technology and Market

  • 4.1 General
  • 4.2 Advanced Technologies: MIMO and Others
    • 4.2.1 Concept
      • 4.2.1.1 Benefits
      • 4.2.1.2 Channel
    • 4.2.2 Spatial Multiplexing
    • 4.2.3 OFDM
  • 4.3 Directions
  • 4.4 Standardization Process
    • 4.4.1 Ratification
    • 4.4.2 Second Draft
    • 4.4.3 Process
    • 4.4.4 Standard Details-Progress in IEEE802.11x Development
      • 4.4.4.1 EWC
  • 4.5 Details: Technology
  • 4.6 Market
    • 4.6.1 General
    • 4.6.2 Market Forecast
      • 4.6.2.1 Model Assumptions
      • 4.6.2.2 Market Forecast
        • 4.6.2.2.1 Chipsets
        • 4.6.2.2.2 Equipment
  • 4.7 Industry Players
    • Airgo (Acquired by Qualcomm)
    • Atheros
    • Belkin
    • Broadcom
    • Intel
    • Linksys (Cisco)
    • Marvell
    • Metalink
    • NEC
    • Netgear
    • RedPine
    • Ruckus
    • SiGe

5.0 Comparison: 802.11n and UWB

  • 5.1 General
  • 5.2 802.11n
  • 5.3 Features Comparison
  • 5.4 Major Applications
  • 5.5 802.11n and UWB Standardization
    • 5.5.1 Similarities and Differences
    • 5.5.2 Assessment
      • 5.5.2.1 Home-Office Environment-WPAN
      • 5.5.2.2 Mobile Applications
      • 5.2.2.3 Inter-Room Connection
    • 5.2.3 Further Development
      • 5.2.3.1 Transmit Power and Signal Bandwidth
      • 5.2.3.2 The Impact of Multipath Fading on Receiver SNR Requirements
      • 5.2.3.3 System Complexity and Power Consumption

6.0 60 GHz Radio-IEEE 802.15.3c

  • 6.1 General
  • 6.2 Specifics
    • 6.2.1 Benefits for WPAN
    • 6.2.2 Applications
    • 6.2.3 Challenges
  • 6.3 Standardization and Development: WirelessHD, IEEE 802.15.3c and Other
    • 6.3.1 WirelessHD
      • 6.3.1.1 Details: WirelessHD Technology
    • 6.3.2 IEEE 802.15.3c
    • 6.3.3 ECMA
  • 6.4 Market
    • 6.4.1 General
    • 6.4.2 Market Obstacles
    • 6.4.3 Forecast
  • 6.5 Players and Projects
    • 6.5.1 Amimon
    • 6.5.2 IBM
    • 6.5.3 SiBeam
    • 6.5.4 Phiar-Motorola
    • 6.5.5 Phiar
    • 6.5.6 NEC
  • 6.6 Comparison
  • 6.7 Applications: 60 GHz WPAN

7.0 Conclusions

Appendix: FCC Ruling

FIGURES:

  • Figure 1: Wireless Technologies
  • Figure 2: UWB Spectrum
  • Figure 3: DS-UWB Characteristics
  • Figure 4: Spectrum Illustration
  • Figure 5: UWB-WPAN Place
  • Figure 6: Market Estimate: UWB Circuitry ($B)
  • Figure 7: Market Estimate: Multiband OFDM UWB Circuitry ($B)
  • Figure 8: Market Estimate: DS UWB Circuitry ($B)
  • Figure 9: Estimate of UWB Market - Communications Applications ($B)
  • Figure 10: Market Estimate for UWB-WPAN Market
  • Figure 11: Basic two-antenna MIMO system with two-stream SDM example
  • Figure 12: 802.11 Protocol Family MAC Frame Structure
  • Figure 13: 802.11n IC Market Estimate ($M)
  • Figure 14: Market Estimate: 802.11n Equipment Shipping ($B)
  • Figure 15: Market Estimate-IEEE 802.11n WPAN
  • Figure 16: 60 GHz "Open" Spectrum
  • Figure 17: IEEE802.15 Structure
  • Figure 18: Market Estimate- WPAN 60 GHz Radio (M $US)
  • Figure 19: 60 GHz WPAN Example

TABLES:

  • Table 1: IEEE 802.15.3c Tasks
  • Table 2: WPAN Major Requirements
  • Table 3: Comparison: DS-UWB and MB-OFDM
  • Table 4: FCC Emission Limits
  • Table 5: Comparison: ECMA Standard
  • Table 6: UWB Applications: Summary
  • Table 7: UWB Market Segments
  • Table 8: Comparison of different 802.11 transfer rates.
  • Table 9: Feature Comparison
  • Table 10: Attenuation
  • Table 11: Properties
Description

[Report]
High-speed WPAN: Technology and Market Development
Published: 2007/11
Published by : Practel, Inc. Practel, Inc.

Price:
US $ 3,950.00 Read Only PDF By E-mail (Single User License)
US $ 4,000.00 Printable PDF by E-mail (Single User License)
US $ 5,600.00 PDF by E-mail (Enterprise License)
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Product Code : PRA57950
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