A review and analysis of the status of indium phosphide (InP) materials and device technology for electronics applications. Discusses the characteristics and performance of InP-based devices such as HBTs and HEMTs. Identifies major electronic component types and applications, including fiber optic communications and RF/wireless, and projects worldwide markets for each application segment for 2002-2006.
Examines the advantages and disadvantages of using InP-based electronic devices. Tabulates companies, universities, research centers, and government agencies with active InP programs, and provides profiles of selected organizations. Includes an extensive bibliography. An appendix reviews the statues of semiconductor activities, including InP, in the People' s Republic of China.
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