Gallium Nitride 2005 - Technology Status, Applications and Forecasts

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

1.1 Introduction

1.2 Technology Summary

1.3 Major Applications

1.4 Major Players

1.5 Market Forecast Summary

1.5.1 Optoelectronics Market Forecast

1.5.2 Electronic Device Market Forecast

1.6 The Report

2. GaN BACKGROUND and MATERIALS PROPERTIES

2.1 History/Initial Applications

2.1.1 Crystal Growth

2.1.2 Thin-Film Deposition

2.1.3 P-type Doping

2.1.4 Etch

2.1.5 Contact Formation

2.1.6 Band Structure

2.1.7 GaN Blue LEDs

2.2 Basic Materials Properties

2.2.1 Crystal Structure

2.2.2 Bandgap

2.2.3 Saturated Electron Drift Velocity

2.2.4 Breakdown Electric Field

2.2.5 Dielectric Constant

2.2.6 Thermal Conductivity

2.2.7 Coefficient of Thermal Expansion

2.2.8 Radiation Hardness

2.3 Competing Materials/Figures of Merit

2.3.1 Competing Materials

2.3.2 Figures of Merit

3. MAJOR APPLICATIONS

3.1 Optoelectronics

3.1.1 LEDs

3.1.2 Laser Diodes

3.1.3 UV Photodetectors

3.1.4 UV Optical Sources

3.2 Electronic Devices

3.2.1 Microwave Power

3.2.2 High Temperature

3.2.3 High Power

4. R&D ISSUES and ACTIVITY

4.1 Status Update

4.1.1 Substrates

4.1.2 Deposited Film Composition/Quality

4.1.3 P-type Doping

4.1.4 Etching

4.1.5 Contacts

4.1.6 Packaging

4.1.7 Historical Review

4.2 Substrates/Substrate Quality

4.2.1 Sapphire

4.2.2 SiC

4.2.3 GaN

4.2.4 AlN

4.3 Epitaxially Deposited GaN Films

4.3.1 Current GaN Deposition Techniques

4.3.2 LEO/ELOG

4.3.3 Pendeoepitaxy

4.3.4 Cantilever Epi Process

4.3.5 Plasma-Assisted MBE/AP-MOCVD

4.4 Contacts

4.4.1 Background

4.4.2 Recent Results

4.4.3 Research Centers with GaN Contact Activity

4.5 Etching of GaN

4.5.1 Background

4.5.2 Etch Update

4.5.3 Etch Chemistries and Techniques

4.5.4 Representative Companies, Universities, and Research Centers with GaN Etch Activity

4.6 Doping

4.6.1 Background

4.6.2 Representative Doping Activity Since 2003

4.7 Packaging

4.7.1 Light Output

4.7.2 LED Heat Transport and Thermal Design

4.7.3 Power LED Packaging

4.7.4 Representative Package Activity

4.7.5 Emerging and Future Packaging Technologies

4.7.6 Electronic Device Packaging

Addendum to Chapter 4: Substrate Suppliers

5. GaN-BASED DEVICE TYPES

5.1 Optoelectronic Devices 5.1.1 Blue, Green, and White LEDs

5.1.2 Blue/Violet Laser Diodes

5.1.3 UV Photodectors and Emitters

5.2 Electronic Devices

5.2.1 Record Performances Summary 5.2.2 Leading-Edge Performance Since 2003 and Excerpted Papers

5.2.3 Power Devices Summary

5.2.4 Microwave Power HEMTs

5.2.5 Power GaN HEMTs on SiC

5.2.6 Low-Noise HEMTs

5.2.7 MESFETs

5.2.8 Piezoelectric/Polarization Effects

5.2.9 Heterojunction/Schottky Diode Rectifiers and Thyristors

5.2.10 HBTs and BJTs

5.2.11 Summary of Companies/Research Centers and Universities Active in GaN-Based Electronic Device Development

6. INDUSTRIAL, ACADEMIC AND GOVERNMENT ACTIVITY

6.1 GaN - Related Industrial Activity

6.1.1 North America

6.1.2 Asia

6.1.3 Europe

6.1.4 Middle East and Africa

6.2 Universities/Research Centers Active in GaN Development

6.2.1 North and South America

6.2.2 Asia-Pacific

6.2.3 Europe

6.2.4 Middle East and Africa

6.3 GaN-Related Government Activities and Funding

6.3.1 North America

6.3.2 Asia

6.3.3 Europe

6.3.4 Australia

6.4 Mini-Profiles of Representative Companies Active in GaN Development

6.4.1 U.S. Companies

6.4.2 Asian Companies

6.4.3 European Companies

6.5 Mini-Proiles of Universities Active in GaN Development

6.6 Mini-Profiles of Government Agencies Supporting GaN Development

6.6.1 U.S.

6.6.2 Taiwan

6.7 The Rise of GaN in Taiwan: GaN Development and Production Status

6.8 The Rise of GaN in China

7. APPLICATIONS ANALYSIS AND MARKET FORECASTS

7.1 Optoelectronics Applications

7.1.1 Background

7.1.2 Blue, Green, and White LEDs

7.1.3 Laser Diodes

7.1.4 UV Devices

7.2 Electronics Applications

7.2.1 Overview

7.2.2 Communications Systems

7.2.3 Industrial

7.2.4 Military/Aerospace

7.2.5 Automotive

7.2.6 Aircraft

7.3 Market Forecast, 2005-2009

7.3.1 Optoelectronics

7.3.2 Electronics BIBLIOGRAPHY