Wide Bandgap Electronics: Technology Trends and Market Forecasts - 2008

1. EXECUTIVE SUMMARY

• 1.1 Overview
• 1.2 Technology Summary
• 1.3 Application and Market Forecast Summary
• 1.4 Summary of Major Players

2. TECHNOLOGY

• 2.1 Basic Materials Properties
• 2.2 Lattice Mismatch with GaN
• 2.3 Material comparisons
  • 2.3.1 High-Frequency
  • 2.3.2 High-Temperature
  • 2.3.3 High-Power
  • 2.3.4 Advantages of Using GaN
  • 2.3.5 Critical Parameters
  • 2.3.6 Figures of Merit
• 2.4 High-Priority Technology Challenges
  • 2.4.1 Substrates
  • 2.4.2 Device/Design Structure
  • 2.4.3 Packaging
  • 2.4.4 P-Type Doping
  • 2.4.5 Contacts
  • 2.4.6 Reliability
  • 2.4.7 Thin-Film Deposition/Epitaxy
  • 2.4.8 Buffer-Layer Composition/Formation
  • 2.4.9 Photolithography
  • 2.4.10 Etching

3. ELECTRONIC DEVICE TYPES

• 3.1 HEMTs/HFETs
• 3.2 MESFETs
• 3.3 MOSFETs
• 3.4 BJTs/HBTs
• 3.5 Schottky Diodes/Rectifiers/Thyristors
• 3.6 Piezoelectric/Pyroelectric Sensors
• 3.7 PIN Diodes
• 3.8 GaN/SiC MMICs (Monolithic Microwave ICs)
• 3.9 Record Performance

4. Widebandgap Electronics Applications

• 4.1 Market Segments by Feature
• 4.2 High-Power Microwave Electronics
  • 4.2.1 The microwave electronics landscape
  • 4.2.2 Competing microwave electronics technologies
  • 4.2.3 Cellular base stations
  • 4.2.4 WiMAX and other wireless MAN base stations
  • 4.2.5 Other communications applications
    • Satellite transponders
    • Wireless backhaul and point-to-point microwave
    • Wi-Fi and new wireless LAN bands
    • Digital broadcast TV
• 4.2.6 Radar
  • Phased array antennas
  • Auto collision avoidance
• 4.2.7 Military
  • Electronic warfare
  • Microwave bombs
  • Non-lethal microwave guns
• 4.2.8 Microwave ovens and other ISM applications
  • Microwave ovens
  • Test and measurement equipment
  • Other exotic applications
• 4.2.9 Total available market for widebandgap microwave electronics
• 4.3 High-Power and High-Voltage Systems
  • 4.3.1 The power management landscape
  • 4.3.2 Power management applications
  • 4.3.3 High-power and high-voltage components
  • 4.3.4 The widebandgap device alternatives
  • 4.3.5 High-power component pricing
• 4.4 High-Temperature (Harsh) Environments
• 4.5 Summary of TAM Forecasts
• 4.6 Applications Overview by Industry
  • 4.6.1 Commercial communications
  • 4.6.2 Military
  • 4.6.3 Spacecraft
  • 4.6.4 Aircraft
  • 4.6.5 Automotive
  • 4.6.6 Industrial and energy
  • 4.6.7 Consumer and office
  • 4.6.8 Breakdown of TAM by end-user sector

5. Widebandgap Electronics Market Forecast

• 5.1 Defect Density Forecast
• 5.2 Linking Prices and Unit Volumes
• 5.3 Three Scenarios
• 5.4 Forecast by Market Segment, 2007-2012
• 5.5 Revenue Forecast by Material Type
• 5.6 Supplier Market Shares
• 5.7 Wafer Size and Supplier Strategy

6. Mini-Profiles of Major Players

• 6.1 Companies
• 6.2 Research Centers and Universities
• 6.3 Government Agencies

7. Bibliography