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[Report]

Global Advances in Electronic/Chip Packaging

Published: 2007/12
Contact 24 hrs/day
Table of Contents

Abstract

The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.

Table of Contents
[Report]
Global Advances in Electronic/Chip Packaging
Published: 2007/12
Published by : Technical Insights, Inc. Technical Insights, Inc.

Price:
US $ 6,000.00 Web Access (Regional License)
US $ 6,500.00 Hard Copy & Web Access (Regional License)
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How to Order?
Product Code : TI58765
Related Topics : Electronic Devices/Semiconductors
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