Thermally Conductive Polymers--An Assessment of Technology Trends

Table of Contents

1 EXECUTIVE SUMMARY

• Scope and Methodology
  • Scope
  • Methodology
• Overview and Study Highlights
  • Overview
  • Study Highlights

2 TECHNOLOGY PRIMER

• Introduction to TCP
  • What are TCPs?
  • Significance of TCP Materials
• Different TCP Materials
  • Polypropylene
  • Acrylonitrile Butadiene Styrene
  • Polycarbonate
  • Nylon
  • Liquid Crystalline Polymers
  • Polyphenylene Sulfide
  • Polyetheretherketone

3 CLASSIFICATION AND APPLICATIONS OF THERMALLY CONDUCTIVE POLYMER COMPOUNDS

• Thermally Conductive Polymer Compounds Variants
  • Thermal Conductive Greases
  • Thermal Conductive Adhesives
  • Thermally Conductive Tapes
  • Thermal Conductive Coatings
  • Thermally Conductive Encapsulants
• Applications
  • Electronics and Lighting Sectors
  • Appliances
  • Fibers and Fabrics
  • Medical
  • Food Contact Material and Processing

4 KEY INNOVATIONS/BREAKTHROUGHS

• Key Innovations/Breakthroughs in the North American Region
  • Improved Dispersion of Aluminum Nitride Particles in Epoxy Resin by Adsorption of Two-Layer Surfactants
  • Advanced Thermal Interface Materials
  • A New Line of Thermally Conductive Compounds for Thermal Management Systems
  • Effect of Single-Walled Carbon Nanotube Purity on the Performance of Nanotube-Based Composites for Thermal Management
  • Modification of Polymers to Provide Thermal Solutions in Heat Generating Applications
  • High-Thermal Conductivity in Organic Adhesives
  • Liquid Crystalline Polymer for Preparation and Storage of Foodstuff
  • Other Key Developments
• Key Innovations/Breakthroughs in the European Region
  • Thermally Conductive Interface Materials-Achieving Optimal Thermal Discharge
  • Thermally Conductive Adhesives for Microelectronics--Barriers of Heat Transport
  • Temperature Dependent Thermal Conductivity of Carbon Nanotube/Epoxy Composites
  • Reduction of Energy Consumption by Using High-Performance Thermoplastics in Light Emitting Devices
• Key Innovations/Breakthroughs in the Asia Pacific Region
  • Novel Heat-Conductive Composite Silicone Rubber and its Properties
  • Thermal Characterization of Thermally Conductive Underfill for a Flip-Chip Package Using Novel Temperature Sensing Technique
  • Thermally Conductive Silicone Rubber Sheet with Super-Low Hardness

5 TECHNOLOGY ADOPTION FACTOR ANALYSIS

• Technology Drivers
  • Advanced Properties of Thermally Conductive Polymers
  • Metal or Ceramic Filler Content Makes Polymers Better
  • Easy Processibility of Custom-Made Products
  • Heat Sink Technology and Packaging of Microprocessor Components
  • Energy Losses
  • Thermal Modeling and Prototyping
  • Low-CTE Mismatch in IC Packages
• Industry Challenges
  • Elevated Temperature--A Concern for Passive Component Manufacturers
  • Silicone-Based Materials Technology
  • Lack of New Materials
  • Cost Considerations in Manufacturing Process
• Trends
  • Current Trends
  • Future Trends
• Application Trend Analysis
  • Introduction
  • Electronics Sector
  • Automotive Sector
  • Aerospace Sector

6 KEY PATENTS AND CONTACTS

• Recent Patents
  • US Patents
  • Other Patents
• Contacts
  • Corporates
  • Universities

7 DECISION SUPPORT DATABASE

• Critical Reference Tables
  • Printed Circuit Board (PCB) Sales--World (2002 to 2012)
  • Office Equipment Contribution to Electronic Industry (2002 to 2012)
  • Semiconductor Market and Semiconductor Equipment Market (2002 to 2012)