Printed Circuit Board: World Outlook

Table of Contents

SECTION ONE

• Summary
• 1.0 Introduction
• 1.1 Executive summary
• 1.2 What is a PCB?
• 1.3 Why PCBs are Used
• 1.4 PCB History

SECTION TWO

• 2.0 PCB technology
• 2.1 PCB Design Considerations
• 2.2 Steps in PCB Design and Manufacture
  • 2.2.1 Component Mounting Techniques
    • 2.2.1.1 Through-Hole PCBs
    • 2.2.1.2 Surface-Mount PCBs
• 2.3 PCB Market by Layers
  • 2.3.1 Single layer PCB
  • 2.3.2 Double layer PCB
  • 2.3.3 Multilayer PCB
    • 2.3.3.1 Case Study - Plotech
  • 2.3.4 Analysis
• 2.4 PCB Market by rigidity
  • 2.4.1 Rigid PCBs
    • 2.4.1.1 Advantages
    • 2.4.1.2 Limitations
    • 2.4.1.3 Popular End Applications
  • 2.4.2 Flexible PCBs
    • 2.4.2.1 Flex PCB Advantages
    • 2.4.2.2 Flex PCB Limitations
    • 2.4.2.3 Popular End Products for Flex PCBs
  • 2.4.3 Rigid-Flex PCBs
    • 2.4.3.1 Advantages of Rigid-Flex PCBs
    • 2.4.3.2 Limitations of Rigid-Flex PCBs
    • 2.4.3.3 Rigid-Flex PCB Popular End Applications
  • 2.4.4 Analysis
• 2.5 PCB Market by Materials
  • 2.5.1 Alumina Substrate
    • 2.5.1.1 Advantages of Alumina as a Substrate
    • 2.5.1.2 Limitations of Alumina as a Substrate
    • 2.5.1.3 End Applications for PCBs with an Alumina Substrate
    • 2.5.1.4 Alumina Substrate Application - Thin-Film Applications
    • 2.5.1.5 Alumina Substrate Application - Facsimile Machines
  • 2.5.2 FR4 Substrate
    • 2.5.2.1 FR-4 Advantages
    • 2.5.2.2 FR-4 Limitations
    • 2.5.2.3 FR-4 Popular End Applications
  • 2.5.3 Beryllium Oxide Substrate
    • 2.5.3.1 Beryllium Oxide Advantages
    • 2.5.3.2 Beryllium Oxide Limitations
    • 2.5.3.3 Beryllium Oxide Popular End Uses
    • 2.5.3.4 Beryllium Oxide Applications - Electro Hydraulics
  • 2.5.4 BT - Epoxy Substrate
    • 2.5.4.1 BT - Epoxy Advantages
    • 2.5.4.2 BT - Epoxy Limitations
    • 2.5.4.3 BT - Epoxy Popular End Applications
  • 2.5.5 Polyimide
    • 2.5.5.1 Polyimide Advantages
    • 2.5.5.2 Polyimide Limitations
    • 2.5.5.3 Polyimide Popular End Applications
  • 2.5.6 PTFE/ Woven Fiberglass Substrate (Teflon)
    • 2.5.6.1 PTFE Advantages
    • 2.5.6.2 PTFE Limitations
    • 2.5.6.3 PTFE Popular End Applications
    • 2.5.6.4 PTFE Application - Precisionfab
    • 2.5.6.5 PTFE Application - Arlon
  • 2.5.7 Hybrid PCB Substrates
    • 2.5.7.1 PTFE/Fiberglass/BT-Epoxy Hybrid Substrate
    • 2.5.7.2 Montmorillonite (MMT)-filled brominated Epoxy Hybrid Substrate
  • 2.5.8 Analysis
• 2.6 Today' s PCB Market Demands and Implications
  • 2.6.1 Approaches for PCB Space Optimization
    • 2.6.1.1 FPGA Space Optimization - Actel
    • 2.6.1.2 LED Space Optimization - Maxim.
    • 2.6.1.3 FPGA Space Optimization - Procon

SECTION THREE

• 3.0 The PCB Business Environment
• 3.1 Application Specific PCBs
  • 3.1.1 Telecommunications
    • 3.1.1.1 Mobile Phone
      • 3.1.1.1.1 Omnidirectional Type PCB Antenna
    • 3.1.1.2 Backplane
  • 3.1.2 Computing Hardware
    • 3.1.2.1 PC
      • 3.1.2.1.1 Motherboard of a PC
      • 3.1.2.1.2 Computer Keyboard
      • 3.1.2.1.3 Storage and Other Computing Applications
  • 3.1.3 CE and Automotive Applications
    • 3.1.3.2 DVD, VCD
    • 3.1.3.3 Camera (Infrared day and night camera)
    • 3.1.3.4 Reed Switches
    • 3.1.3.5 Position sensing application
    • 3.1.3.6 Brake lever sensing application
    • 3.1.3.7 Fuel level sensing application
    • 3.1.3.8 Electronically-locked door sensors application
  • 3.1.4 Other Applications
    • 3.1.4.1 Photoelectric fire/smoke detector/alarm
    • 3.1.4.2 Water boilers and Control units
    • 3.1.4.2 Medical Ultrasound System
    • 3.1.4.3 Pressure Sensors
  • 3.1.5 Analysis
• 3.2 Business Drivers
  • 3.2.1 High Speed and High Frequency Signals
    • 3.2.1.1 High Speed and High Frequency Signal Challenges
    • 3.2.1.2 Approaches to Counter Challenges
      • 3.2.1.2.1 Microstrips
      • 3.2.1.2.2 Striplines
  • 3.2.2 Semiconductor Packaging technology innovations
    • 3.2.2.1 CSP/WLP
    • 3.2.2.2 PGA/BGA
    • 3.2.2.3 FC
    • 3.2.2.4 MCM
    • 3.2.2.5 SiP
    • 3.2.2.6 PoP
  • 3.2.3 Packing integration technology/System on the Package
  • 3.2.4 Advances in EDA
    • 3.2.4.1 Initial EDA/CAD Tools
    • 3.2.4.2 Conventional Procedure to Use CAD Tools
    • 3.2.4.3 Contemporary PCB Design Tools
  • 3.2.5 Miniaturization
    • 3.2.5.1 Laser and Photonic Methods for Micro Vias
• 3.3 PCB Industry Issues and Challenges
  • 3.3.1 Application Issues: Analog, Digital and Mixed Signal PCBs
    • 3.3.1.1 Analog PCBs
      • 3.3.1.1.1 Analog Design Challenges and Limitations
      • 3.3.1.1.2 Technology Advances and Workarounds
      • 3.3.1.1.3 Case Study - Blacet Research
    • 3.3.1.2 Digital PCBs
      • 3.3.1.2.1 Digital Design Challenges and Limitations
      • 3.3.1.2.2 Technology Advances and Workarounds
    • 3.3.1.3 Mixed Signal PCBs
      • 3.3.1.3.1 Importance of Grounding in Mixed Signal PCBs
      • 3.3.1.3.2 Other Design Considerations
      • 3.3.1.3.3 Mixed Signal PCB Applications
      • 3.3.1.3.4 Case Study - Maxim
  • 3.3.2 Environmental Issues
• 3.4 Market Push and Pull
  • 3.4.1 Impact of Raw Material Price Fluctuations
  • 3.4.2 Outsourced Manufacturing Trends
• 3.5 The Geographical Distribution of PCB Manufacturers and Market Realities Going Forward
  • 3.5.1 Geographical Region Metrics
    • 3.5.1.1 North American PCB Production Revenues and Market Demand Expenditures
    • 3.5.1.2 European PCB Production Revenues and Market Demand Expenditures
    • 3.5.1.3 APAC Region PCB Production Revenues and Market Demand Expenditures
    • 3.5.1.4 ROW PCB Production Revenues and Market Demand Expenditures
    • 3.5.1.5 Analysis

TABLES AND FIGURES

• Table 1-1: World PCB Revenues 2007-2012
• Table 2-1: Global Single Layer PCB Revenues 2007-2012
• Table 2-2: Global Double Layer PCB Revenues 2007-2012
• Table 2-3: Global Multi-Layer PCB Revenues 2007-2012
• Table 2-4: Shares of Layered PCBs vs. Global PCB Production 2007 and 2012
• Table 2-5: Global Rigid PCB Revenues 2007-2012
• Table 2-6: Global Flex and Rigid Flex PCB Revenues 2007-2012
• Table 2-7: Share of Rigid and Flex PCBs vs. Global PCB Production 2007 and 2012
• Table 2-8: Substrate Material Properties
• Table 2-9: Global Revenues for PCB Substrate Material 2007-2012
• Table 2-10: PCB Substrate Share of Global PCB Market 2007-2012
• Table 3-1: Global PCB Revenues for PCBs Used in Telecommunications Applications 2007-2012
• Table 3-2: Global PCB Revenues for PCBs Used in Computing Hardware Applications 2007-2012
• Table 3-3: Global PCB Revenues for PCBs Used in Automotive Applications 2007-2012
• Table 3-4: Global PCB Revenues for PCBs Used in Industrial, Medical, Military and Other 2007-2012
• Table 3-5: Overall Shares of Global PCB Revenues by Application 2007 and 2012
• Table 3-6: Global Revenues for PCB/MCM EDA Tools 2007-2012
• Table 3-7: Global Revenues for HDI Microvia PCBs 2007-2012
• Table 3-8: HDI/Microvias Share of Global Multi-layer PCB Revenues 2007-2012
• Table 3-9: North American PCB Production Revenues and Market Demand Expenditures 2007-2012
• Table 3-10: Europe PCB Productions Revenues and Market Demand Expenditures 2007-2012
• Table 3-11: APAC PCB Production Revenues and Market Demand Expenditures 2007-2012
• Table 3-12: The ROW PCB Production Revenues and Market Demand Expenditures 2007-2012
• Table 3-13: Regional PCB Revenues Share, NA, Europe, APAC and Other 2007 and 2012
• Table 3-14: Regional PCB Expenditures Share, NA, Europe, APAC and Other 2007 and 2012
• Table A-1: Cellular and NGN Base Station Deployments, All Technologies World Market 2006-2012
• Table A-2: Telematics Users, World Market 2005-2011
• Table A-3: Total Vehicles Equipped with Navigational Devices, World Market 2005-2011
• Table A-4: Mobile Subscribers, All Technologies World Market 2006-2012
• Table A-5: Cellular Phone Shipments, World Market 2005-2011
• Table A-6: Mobil Television Users, World Market 2005-2011