Abstract
The ultimate report to weight the strength and weakness of existing 3D ICs
technologies, and see who is doing what in term of 3D packaging among the key
players
The technical issues for innovative 3D packaging at the wafer level are close
to be solved.
Yole' s latest report highlights the market drivers for 3D packaging
technologies, the status of developments, how it will impact the semiconductor
food chain. It covers as well equipments market forecasts and technical
analyses of the different solutions with extensive exclusive technical
explanation, figures and abstracts.
3D integration will affect the IC, MEMS and image sensors markets!
Semiconductor chips face constant pressure for increased performances while
still decreasing their size and at the same time their packages must be able
to accommodate new functionalities. The ever-expanding consumer electronics
market is a particularly strong driver of packaging innovations such as 3D
ICs. Today wire bonding is limited in density and performances so 3D stacking
with micro-vias (or TSV, "through-Si vias") seems to be unavoidable in the
future for miniaturization first and increased performances after.
3D integration will use technologies originally developed for MEMS technology
but for different markets. In our report, we have analyzed that portable
applications are a strong market driver for 3D integration. Stacking memories,
stacking memories and logic, image sensors with μP and FPGAs will be the
first mass market applications. In 2010, we forecast that 1 billion of Flash
memories will be stacked with TSVs
3D-ICs: the technical challenges are close to be overcome
3D is the most "integrated" approach and is an enabling technology platform
applicable to digital and mixed signal electronics, wireless, electro-optical,
MEMS, sensors, smart imagers, displays and other devices. There are however
strong challenges. They are: thermal management, reliable co-design and
simulation tools, industrial wafer-to-wafer bonding tools, low-cost
through-wafer via structures and via fill processes. In our report we have
analyzed and compared the different technical solutions
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