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[Report]

Global MEMS/Microsystems - Markets and Opportunities

Published: 2007/08

Contact 24 hrs/day
Description

Table of Contents

EXECUTIVE SUMMARY

  • Market
  • Applications
  • Materials and Manufacturing Technology

1 INTRODUCTION

  • 1.1 Methodology
  • 1.2 Definition of Terms

2 MEMS MARKET OVERVIEW

  • 2.1 MEMS Device Market and Forecast
  • 2.2 MEMS Equipment Market and Forecast
  • 2.3 MEMS Material Market and Forecast

3 MEMS APPLICATIONS-TRENDS AND OPPORTUNITIES

  • 3.1 Inkjet Heads
    • 3.1.1 Overview
    • 3.1.2 Market Outlook
    • 3.1.3 Key Players
    • 3.1.4 Application and Technology Trends
    • 3.1.5 Manufacturing Trends
  • 3.2 Pressure Sensors
    • 3.2.1 Overview
    • 3.2.2 Market Outlook
    • 3.2.3 Key Players
    • 3.2.4 Application and Technology Trends
    • 3.2.5 Manufacturing Trends
  • 3.3 Silicon Microphones
    • 3.3.1 Overview
    • 3.3.2 Market Outlook
    • 3.3.3 Key Players
    • 3.3.4 Application and Technology Trends
    • 3.3.5 Manufacturing Trends
  • 3.4 Accelerometers
    • 3.4.1 Overview
    • 3.4.2 Market Outlook
    • 3.4.3 Key Players
    • 3.4.4 Application and Technology Trends
    • 3.4.5 Manufacturing Trends
  • 3.5 Gyroscopes
    • 3.5.1 Overview
    • 3.5.2 Market Outlook
    • 3.5.3 Key Players
    • 3.5.4 Application and Technology Trends
    • 3.5.5 Manufacturing Trends
  • 3.6 Digital Micromirror Display and Other MOEMS
    • 3.6.1 Overview
    • 3.6.2 Market Outlook
    • 3.6.3 Key Players
    • 3.6.5 Manufacturing Trends
  • 3.7 Microfluidics
    • 3.7.1 Overview
    • 3.7.2 Market Outlook
    • 3.7.3 Key Players
    • 3.7.4 Application and Technology Trends
    • 3.7.5 Manufacturing Trends
  • 3.8 RF MEMS
    • 3.8.1 Overview
    • 3.8.2 Market Outlook
    • 3.8.3 Key Players
    • 3.8.4 Application and Technology Trends
    • 3.8.5 Manufacturing Trends
  • 3.9 Emerging MEMS
    • 3.9.1 Overview
    • 3.9.2 Energy Harvesting Devices
    • 3.9.3 Multi-Frequency Oscillator
    • 3.9.4 Silicon-Based Micro Motor
    • 3.9.5 Auto Focus and Micro Zoom

4 MATERIALS AND PROCESS TECHNOLOGIES-TRENDS AND OPPORTUNITIES

  • 4.1 CMOS-MEMS Integration
  • 4.2 Substrates
  • 4.3 Lithography, Photoresists and Ancillaries
  • 4.4 Wafer Bonding
  • 4.5 Deposition and Etch
  • 4.6 Anti-Stiction
  • 4.7 Chemical Mechanical Planarization (CMP)
  • 4.8 Packaging

5 APPENDICES

  • 5.1 MEMS Equipment Suppliers by Segment
  • 5.2 MEMS Materials Suppliers by Segmen
  • 5.3 Companies Interviewed
  • 5.4 List of Acronyms and Abbreviations
  • 5.5 List of Figures and Tables

List of Figures and Tables

List of Figures

  • Figure 2.1 The MEMS Supply Chain
  • Figure 2.2 Top 30 MEMS Sales/Worldwide MEMS Sales 2003-2006
  • Figure 3.1 Global Inkjet Head Market Forecast
  • Figure 3.2 2006 Global Inkjet Head Market Share
  • Figure 3.3 Global Pressure Sensor Market Forecast
  • Figure 3.4 2006 Global Pressure Sensors Market Share
  • Figure 3.5 Global MEMS Silicon Microphone Market Forecast
  • Figure 3.6 Global Accelerometer Market Forecast
  • Figure 3.7 Global Gyroscope Market Forecast
  • Figure 3.8 Automotive Electronic Stability Functions and Components
  • Figure 3.9 Global MOEMS Market Forecast
  • Figure 3.10 Products Which Require A Compact Light Engine
  • Figure 3.11 Light Engine Market Value
  • Figure 3.12 Global Microfluidics Market Forecast
  • Figure 3.13 Global RF MEMS Market Forecast
  • Figure 3.14 Perpetuum Energy Harvester
  • Figure 3.15 Typical Micro Fuel Cell Design
  • Figure 3.16 SEM of MEMS First™WaferSiTime Products
  • Figure 3.17 Liquid Lens in Operation
  • Figure 4.1 Five Levels of Monolithic Integration
  • Figure 4.2 MEMS in the Middle
  • Figure 4.3 Beside IC or Pre-CMOS Process
  • Figure 4.4 Above-IC Approach
  • Figure 4.5 Integrated MEMS Market Forecast
  • Figure 4.6 MEMS Substrate Market by Type
  • Figure 4.7 Thick SOI Wafers for MEMS Devices
  • Figure 4.8 Silicon Substrate Market by Diameter
  • Figure 4.9 Photoresist and Ancillary Market Forecast
  • Figure 4.10 Gases and Chemicals Market Forecast
  • Figure 4.11 How Stiction Occurs
  • Figure 4.12 Examples of Stiction on MEMS Devices
  • Figure 4.13 Use of Supercritical CO2 and Self-Assembling Monolayer in the Device Process Flow
  • Figure 4.14 SAM Materials for Anti-Stiction
  • Figure 4.15 Packaging Coating Market Forecast
  • Figure 4.16 SU-8 Applications

List of Tables

  • Table 2.1 Top 30 MEMS Device Manufacturers
  • Table 2.2 Top 12 MEMS Foundries
  • Table 2.3 MEMS Device Markets and Forecasts by Application
  • Table 2.4 MEMS Equipment Markets and Forecasts
  • Table 2.5 MEMS Material Markets and Forecasts
  • Table 3.1 Comparison of Nozzle Manufacturing Technologies
  • Table 3.2 Accelerometer Forecast by Application
  • Table 3.3 Gyroscope Forecast by Application
  • Table 3.4 MOEMS Device Function and Applications
  • Table 3.5 Microfluidics Food Chain
  • Table 3.6 Current Microfluidics Markets
  • Table 3.7 Microfluidic Application Drivers
  • Table 3.8 Microfluidic Manufacturing Technologies
  • Table 3.9 Emerging MEMS Products by Company
  • Table 3.10 Global Emerging MEMS Market Forecast
  • Table 3.11 Comparison of Competing AF/MZ Technologies
  • Table 4.1 MEMS Substrate Market Forecast
  • Table 4.2 Substrates by MEMS Device Type
  • Table 4.3 Silicon Wafer Consumption by Diameter (in Thousands of Units)
  • Table 4.4 Etching and Release of Sacrificial Layers in MEMS Devices
  • Table 4.5 MEMS CMP Versus IC CMP
  • Table 4.6 MEMS Packaging Requirements and Trends
Description

[Report]
Global MEMS/Microsystems - Markets and Opportunities
Published: 2007/08
Published by : Yole Developpement Yole Developpement

Price:
US $ 2,990.00 PDF by E-mail (Single User License)
US $ 3,880.00 PDF by E-mail (Multi-user, single site license)
US $ 5,382.00 PDF by E-mail (Multi-user, multi-site license)
>
Product Code : YD57459
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