Lumileds Luxeon Rebel LED LampTeardown and Technology Analysis

Table of Contents

1. Product Identification

2. External Appearance and Principal Dimensions

3. Package General Description

• - Substrate structure and material
• - Die configuration and attach
• - Electrical protection
• - Phosphor and encapsulation
• - Table of package parameters

4. Semiconductor Die

• - Materials, dimensions, and singulation
• - Back-side appearance
• - Front-side interconnect
  • Redistribution layer
  • Lower level contact
  • Upper level contact
• - Epi-stack
• - Table of die process parameters

5. Summary