GaN RF '08

• Glossary
• Executive summary
• Latest noteworthy news
• 2007 noteworthy news
• 2006 noteworthy news

GaN RF device market analysis

• Possible applications for GaN devices in RF electronic systems
• GaN device applications roadmap. Time to market
• Technology drivers and FOM for GaN: High Frequency, High Power and Linearity
• GaN RF device market breakdown. 2007 - 2012 comparison
• 2005-2012 GaN RF device market size. Nominal scenario
• 2005-2012 GaN RF device market size. Table of data: units / ASP / revenues
• 2005-2012 GaN RF device market size Alternative pessimistic scenario
• Analysis of the 2 scenarios. What can we trust in.......?
• 4” epi-wafer needs for GaN-based RF devices market 2005-2012
• Tentative forecast for RF GaN epiwafer market size 2005-2012
• Conclusions and perspectives

GaN HEMT state of the art

• GaN and Silicon FET structure comparison
• GaN / SiC / Si / GaAs high power RF transistors comparison
• Microwave frequencies bands. Comparison of Si, SiGe, GaAs, InP and GaN frequency and Vb ranges
• GaN FET state-of-the-art: Company / Technology / Pmax / Gain / Fmax / PAE / Vds / Gate width
• Latest GaN RF HEMT results Example of IMEC HEMT GaN/Si Examples of RFMD offer in GaN HEMT (S.I. SiC)
• Examples of Eudyna offer in GaN HEMT (S.I. SiC)
• Examples of CREE offer in GaN HEMT & SiC MESFET
• Examples of Nitronex offer for GaN HEMT (GaN-on-Silicon)
• Cost breakdown of HEMT process: GaN/SiC (3”)
• Cost breakdown of HEMT process: GaN/Si (4”)
• GaN FET commercialization status & announcements

GaN RF device industrial landscape

• Food chain & players in GaN RF business (R&D or production)
• Industrial supply-chain in the US
• Industrial supply-chain in Europe
• Industrial supply-chain in Asia
• Origin of the companies now involved in GaN technology
• Strategy of Si LDMOS companies over the GaN technology

Wireless phone infrastructures: Base stations (BTS) market

• Market drivers of the GaN for BTS
• Remote radio head (RRH) antenna
• Recent announcements in GaN-based technologies for 3G BTS market
• Wireless-phone infrastructure market shares in 2007
• Si LDMOS vs. GaAs pHEMT 2007 status
• Market shares of Si LDMOS vendors for wireless infrastructure in 2007
• WCDMA BTS typical cost distribution
• Wireless phone base-station price analysis (GSM vs. 3G)
• Base stations: 2007 value-chain analysis
• 2005-2012 mobile-phone subscribers in units and AGR (%) Worldwide deployed macro cellular base-stations 2005-2012 by standards
• Components currently used in base stations
• Estimation of total accessible market for GaN FET in 3G BTS
• Number of 4” equivalent wafers to be produced for GaN FET manufacturing for 3G base stations market (Conservative scenario)
• Number of 4” equivalent wafers to be produced for GaN devices manufacturing for 3G base stations market (Breakthrough scenario)

Defense market

• Market drivers of GaN RF electronics in defense applications
• Focus on defense applications Worldwide estimation of the Total Accessible Market (TAM) for wide Bandgap RF transistors
• Roadmap for RF transistors volumes in defense applications
• 4” equivalent wafers needs in units for GaN MMIC manufacturing for defense market
• On-going R&D programs in the US for GaN in defense applications
• Example of US DARPA requests: Wide Band Gap Semiconductors for RF Applications (WBGS-RF)
• On-going R&D programs in Europe for GaN in defense applications: Korrigan

Satellite market

• Market drivers of the GaN electronics in SatCom

V-SAT terminals market

• Market drivers of GaN electronics in V-SAT
• V-SAT market data
• GaN HEMT opportunities for V-SAT Estimated 4” wafers annual needs

CATV market

• Market drivers of GaN electronics in CATV
• CATV market data
• GaN HEMT opportunities for CATV. Estimated device volume and 4” epi-wafer needs

WiMAX vs. LTE. The race toward 4G has already started.....

• WiMAX & LTE history and definition
• Positioning of WiMAX & LTE over the data rate and the mobility range
• WiMAX / LTE technical comparison
• WiMAX vs. LTE Current positioning of key companies
• WiMAX and LTE deployment planning
• WiMAX technology
• WiMAX standards
• WiMAX profiles/spectrum bands
• WiMAX network requirements
• WiMAX market trends
• WiMAX players
• WiMAX players : a complex food chain
• WiMAX market estimation 2005-2012 subscribers projection
• Market drivers for GaN in WiMAX
• What will be the best GaN substrate for base station application ? Si or SiC
• Tentative market estimation for WiMAX BTS and related PA & RF transistors market
• 2005-2012 worldwide annual volume and related sales for WiMAX BTS infrastructures
• 2005-2012 annual production of GaN 4” wafers for WiMAX BTS infrastructures
• Conclusions: How WiMAX vs. LTE and related frequency spectrum choices will impact the GaN RF market?

GaN RF devices. European developments

• European industrial food chain
• Korrigan : the key R&D GaN military project in Europe
• HYPHEN: Hybrid Substrates for Competitive HF Electronics
• GaN-Switchmode: GaN HEMT for base stations
• Power RF foundries in Europe

GaN RF devices. Japanese developments

• Japanese NEDO R&D programs

GaN material. Current developments

• Direct growth or buffer approach
• Composite substrates: wafer bonding approach
• Picogiga SOITEC (F). SopSiC (Silicon on Poly-SiC) substrate
• Aonex Technologies, now AmberWave Systems (US) A-Sapph & A-GaN
• BluGlass. GaN on Glass
• IMEC (B). GaN on Germanium. Ge (111)
• IMEC (B). GaN on Silicon
• Azzurro Semiconductors (D). GaN on Silicon
• Covalent Materials (J). GaN on Silicon (with 3C-SiC buffer layer)
• Nitronex (US). GaN on Silicon
• TDI, now Oxford Instruments (US). GaN/SiC and GaN/Sapphire
• Hitachi Cable (J). GaN/SI.I SiC and GaN/Sapphire
• Cermet (US). GaN on ZnO
• SOD: Silicon On Diamond. Main advantages for GaN growth (1/2)
• Group4 Lab (US). GaN/Diamond. Double wafer bonding approach
• sp3 Diamond Technology (US). DOS (Diamond on Si) & SOD
• Bulk / free-standing GaN wafers status
• GaN / Silicon epiwafer manufacturers status
• GaN/Sapphire & GaN/SiC epiwafer manufacturers status
• Examples of current GaN material pricing

Main metrics of the SiC and Sapphire substrate markets

• Main SiC material manufacturing site locations. Bulk or epi-foundry
• Material polytypes, doping & orientation commercially available
• 2006 & 2007 SiC substrate vendor revenues & related market share. Focus on S.I. SiC market
• Diameter evolution for semi-insulating SiC substrates to 2012
• 2005-2012 S.I. SiC substrates price evolution for various diameters
• Map of sapphire suppliers location 2007 Total sapphire vendor revenues (split by Optics & Electronics)
• 2005-2012 sapphire substrate price projection, split by diameter

Review of the main GaN RF devices in production or in development: (Device structure, Main specs, Reliability, .....)

• CREE
• Eudyna
• Freescale
• Fujitsu
• KOPIN
• Matsushita MEI / Panasonic
• NEC
• Nitronex
• OKI
• RFMD
• TriQuint
• Toshiba
• UCSB